Circuit Board Assembly Using a Connection Board to Eliminate Stubs
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Solution Overview
Problem
The generation of stubs in signal holes of circuit boards deteriorates signal quality, limiting the maximum rate of random access memory and overall performance of electronic devices.
Innovation Solution
A circuit board assembly that uses a connection board to facilitate conduction between electronic components, avoiding stubs in signal holes and allowing full utilization of signal channels, thereby improving signal quality and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If signal transmission is implemented through signal holes in the circuit board body, then signal transmission between electronic components is achieved, but stubs are generated that deteriorate signal quality
Solution Approach 1:
The circuit board structure is segmented into a circuit board body and a separate connection board. The connection board is positioned at the opposite side of the circuit board body and provides alternative signal transmission paths that avoid stub formation in the circuit board body's signal holes.
Solution Approach 2:
The connection board acts as an intermediary structure between electronic components on opposite sides of the circuit board body. It provides dedicated signal transmission channels that eliminate the harmful stub effect while maintaining electrical connectivity.
2Reliability
If back-drilling process is used to eliminate stubs, then signal quality improves, but manufacturing complexity and costs increase
Solution Approach 1:
The harmful stub formation problem is extracted and relocated to the connection board design phase rather than being addressed through post-manufacturing back-drilling processes. The connection board is designed to inherently avoid stub creation while maintaining signal integrity.
Solution Approach 2:
The connection board is pre-designed and positioned to provide optimal signal transmission paths before final assembly. This preliminary structural arrangement prevents stub formation from occurring in the first place, eliminating the need for corrective back-drilling operations.
3Volume of moving object
If electronic components are placed closer together, then device size is reduced, but signal interference increases
Solution Approach 1:
The connection board extends the signal transmission path into a third dimension (vertical layering) rather than relying solely on horizontal routing on the circuit board body. This dimensional transition allows components to be placed closer horizontally while maintaining signal integrity through the vertically positioned connection board.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures better signal quality and performance of electronic components by preventing stub formation, allowing for closer component placement and reducing interference, while maintaining or improving signal rates.
Implementation Method 1
a connection board, located on a side of the circuit board body opposite to the first electronic component, and in conduction with the first electronic component through the first signal hole
Data Source
AI summary
Embodiments of this application provide a circuit board assembly and an electronic device. The circuit board assembly includes a circuit board, a connection board, and a second electronic component. The circuit board has a circuit board body and a first electronic component, and the first electronic component is located on the circuit board body. A first signal hole is provided on the circuit board body. The connection board is located on a side of the circuit board body opposite to the first electronic component, and is in conduction with the first electronic component through the first signal hole. The second electronic component is in conduction with the connection board.