Circuit Board Subregion Removal via Adhesion Prevention
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for removing subregions from circuit boards often result in damage to adjacent regions due to manual handling or bending, especially on small and finely structured boards, as they require mechanical stressing and lack efficient adhesion prevention.
Innovation Solution
The method involves applying an adhesion-preventing material to the subregion to be removed, coupling its external surface to an external element, and using this element to lift and separate the subregion, thereby avoiding mechanical stress on the adjacent circuit board regions, and optionally inducing crack formation or twisting to facilitate easy and automatic removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If manual lifting or bending processes are used to remove subregions from circuit boards, then the removal process can be performed, but damage occurs to adjacent regions of the circuit board
Solution Approach 1:
The adhesion-preventing material is applied to the subregion before the lamination process, preventing adhesion in advance. This preliminary action ensures that when the subregion is later removed using lifting or bending processes, it separates cleanly without damaging adjacent circuit board regions.
Solution Approach 2:
The adhesion-preventing material is applied selectively only to the specific subregion that needs to be removed, rather than the entire circuit board. This local application creates a differentiated adhesion property: the subregion has low adhesion (easy to remove) while adjacent regions maintain normal adhesion (remain intact during removal).
2Object-affected harmful factors
If adhesion-preventing material is applied to prevent damage during removal, then damage to adjacent regions is avoided, but the process complexity increases
Solution Approach 1:
The adhesion-preventing material serves a dual function: it prevents adhesion during lamination (protecting the subregion) and facilitates automatic removal later. The material essentially performs the protection and removal facilitation functions automatically based on its inherent properties, reducing the need for additional complex process steps.
3Productivity
If manual removal methods are used on small and finely structured circuit boards, then removal is possible, but the risk of damage increases significantly
Solution Approach 1:
The invention replaces the direct mechanical lifting/bending action (which causes damage on fine structures) with a chemical/adhesion-based separation mechanism. The adhesion-preventing material creates a non-mechanical separation interface, allowing removal through controlled delamination rather than forceful mechanical lifting, thus protecting delicate circuit structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables reliable and damage-free removal of subregions from circuit boards, improving the efficiency and precision of the process by allowing for easy and automated separation without mechanical stressing, thus enhancing the production method.
Implementation Method 1
providing an adhesion-preventing material in the region of the subregion of the circuit board or a layer or ply thereof to be removed subsequently, such that following a connection of a plurality of plies or layers of the circuit board, edge regions of the subregion to be removed are severed or separated
Data Source
AI summary
Methods for the production of a circuit board involving the removal of a subregion in accordance with various embodiments of the invention are disclosed. In one embodiment, the production of a circuit board, made of at least two interconnected layers of material, involving the removal of a subregion including a portion of at least one of the at least two interconnected layers from the circuit board includes providing an adhesion preventing material under the subregion to be removed to a layer in the at least two interconnected layers that is adjacent to the at least one layer including the subregion, separating edge regions of the subregion to be removed from adjoining regions of the circuit board, connecting an external surface of the subregion to be removed to an external element, and displacing the external element to separate the subregion to be removed from the adjacent layer of the circuit board.