Circuit Board Assembly With Support Bodies for Stronger Solder Joints
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing circuit board assemblies prone to failure due to weak solder joints, which can lead to separation of circuit boards and frame plates under uneven forces, such as drops or collisions.
Innovation Solution
A circuit board assembly design that includes a frame plate, circuit boards, support bodies, and large solder joints. The support bodies maintain a predetermined spacing between the frame plate and circuit board pads, preventing the solder paste from overflowing and ensuring large, strong solder joints are formed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the number of components and their connection parts are reduced, then assembly complexity is lowered, but signal interference and noise may increase due to closer proximity of components
Solution Approach 1:
The circuit board employs different ground pattern densities in different regions: dense ground patterns in areas with high-speed signal lines to shield against interference, and sparser ground patterns in areas with low-speed signals. This localized optimization allows component proximity for simplified assembly while maintaining signal integrity through region-specific electromagnetic shielding.
Solution Approach 2:
The ground connection structure is segmented into multiple independent ground patterns rather than a single continuous ground. Each ground pattern is strategically positioned to provide localized shielding for specific signal lines, allowing the system to achieve both compact component layout and effective noise reduction through distributed grounding zones.
2Volume of moving object
If high-speed signal lines are placed closer together to reduce board size, then device miniaturization is achieved, but crosstalk and electromagnetic interference increase
Solution Approach 1:
Ground patterns serve as intermediary shielding structures positioned between adjacent high-speed signal lines. These ground patterns act as electromagnetic barriers that prevent direct coupling between neighboring signals, enabling closer signal line spacing while maintaining signal integrity through the mediating ground structures.
Solution Approach 2:
The ground pattern density is locally optimized based on signal line proximity: areas with closely spaced high-speed signals receive denser ground patterns for enhanced shielding, while areas with spaced-out or low-speed signals use sparser grounding. This localized quality adjustment enables miniaturization without compromising signal quality.
3Reliability
If the ground pattern density is increased to reduce noise, then signal integrity improves, but manufacturing complexity and cost increase
Solution Approach 1:
The ground pattern is segmented into multiple discrete regions with varying densities rather than using uniform high-density grounding throughout. This segmentation allows high signal integrity in critical areas while reducing manufacturing complexity in less critical areas, optimizing the balance between performance and manufacturability.
Solution Approach 2:
Different ground pattern densities are applied locally based on signal requirements: high-density grounding in areas with sensitive high-speed signals, and lower-density grounding in areas with robust or low-speed signals. This local quality differentiation achieves necessary signal integrity while minimizing overall manufacturing complexity and cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances the connection strength between the frame plate and circuit boards, reducing the likelihood of separation under uneven forces and minimizing the risk of short circuits, thereby improving the yield and reliability of the circuit board assembly.
Implementation Method 1
the circuit board does not move close to the frame plate under the action of its own gravity
Implementation Method 2
After the solder paste is melted, the circuit board is limited by the support bodies. Therefore, the circuit board does not move close to the frame plate under the action of its own gravity
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
Embodiments of this application provide a circuit board assembly and an electronic device. The circuit board assembly includes at least a frame plate, circuit boards, support bodies, and solder joints. The frame plate includes a frame body and first pads provided on the frame body. The circuit boards each are provided on one side of the frame plate. The circuit board includes a board body and second pads provided on the board body. The first pads face the second pads. The support bodies are provided between the frame plate and the circuit boards. The support bodies are configured to support the circuit boards, so that a predetermined spacing exists between the first pads and the second pads. The support bodies each include a first support portion and a second support portion. The first support portion and the second support portion are stacked along a thickness direction of the frame plate. The first support portion is connected to the frame body. The second support portion is connected to the board body. Solder joints are provided between the first pads and the second pads. The solder joints connect the first pads to the second pads. The circuit board assembly in this application can ensure that a large solder joint is formed between two pads. This is conducive to improving connection strength between the pads.