Circuit Board Tape Joining Method for Sprocket Hole Alignment
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Solution Overview
Problem
Conventional circuit board tapes experience misalignment due to unpredictable cutting of defective regions, leading to varying distances between sprocket holes after joining, which can cause separation from transmission elements during processing.
Innovation Solution
The circuit board tape design includes equidistantly arranged sprocket holes on substrate units with a joining method that uses imaginary lines to define cut portions, ensuring odd numbers of sprocket holes between adjacent units, allowing for precise rejoining without altering the sprocket hole distance, thereby maintaining alignment with transmission elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the circuit board tape is cut at the defective region, then the defective layout is removed, but the distance between sprocket holes on the front and rear tapes becomes different, causing misalignment with transmission elements
Solution Approach 1:
The circuit board tape is divided into multiple substrate units, each containing a specific number of sprocket holes (odd number). This segmentation ensures that when cutting occurs at defective regions, the remaining units maintain consistent sprocket hole distances because each unit is designed with a standardized odd number of sprocket holes that align with transmission element tooth pitches
Solution Approach 2:
The patent changes the parameter of sprocket hole arrangement by ensuring an odd number of sprocket holes between adjacent imaginary lines. This parameter change allows the tape to maintain alignment after cutting because the odd number configuration ensures that the combined sprocket holes from front and rear tapes always form an equidistant sequence matching transmission element requirements
2Productivity
If more layouts are arranged on the circuit board tape, then productivity increases, but the tape length increases, requiring more transmission element tooth pitches
Solution Approach 1:
Multiple layouts are arranged on individual substrate units within a compact tape structure. Each substrate unit contains a complete set of sprocket holes and layout regions, allowing multiple circuits to be processed simultaneously on a single tape without proportionally increasing the transmission element requirements
Solution Approach 2:
Multiple layouts are merged onto a single circuit board tape in a multi-layer or multi-row configuration. This merging allows several circuit boards to be produced from one tape, increasing productivity while maintaining the same tape length and transmission element tooth pitch requirements through efficient space utilization
Data Source
AI summary
A circuit board tape includes substrate units each including a sprocket-hole region, a layout region and a joining mark. There are odd and more than three sprocket holes on the sprocket-hole region. An imaginary line extended from the joining mark is extended to between a first layout and a second layout located on the layout region. The amount of the sprocket holes between the imaginary lines of the adjacent substrate units is odd. The circuit board tape is cut along the imaginary lines of the different substrate units so as to remove the defective substrate unit from the circuit board tape and divide the circuit board tape into a front tape and a rear tape. After joining the front and rear tapes, the region where a first layout on the front tape and a second layout on the rear tape are located is defined as a combined layout region.