Circuit Board Pads on Temporary Substrates for Uniform Coating Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing circuit board structures face issues with warpage defects in pads, leading to inaccurate control of surface treatment layer thickness and uniformity, which limits the ability to reduce the gap between pads and increase density.
Innovation Solution
A manufacturing method involving a temporary substrate with a flat surface treatment layer formed on a ceramic, glass, or silicon substrate, allowing precise control of thickness and uniformity, and forming pads without overlap, enabling gas escape through through holes to prevent bubble accumulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the surface treatment layer is formed on the pad after pad formation, then the bonding between pad and electrical connection structure is facilitated, but the thickness and uniformity of the surface treatment layer cannot be accurately controlled due to warpage defects
Solution Approach 1:
The surface treatment layer is formed on the pad in advance before the pad is fully formed and before assembly. This preliminary action allows the surface treatment layer to be deposited on a relatively stable substrate before warpage and deformation occur during subsequent manufacturing steps, thereby ensuring accurate control of thickness and uniformity while maintaining bonding reliability
Solution Approach 2:
The manufacturing process is divided into distinct stages: first forming the surface treatment layer on the pad, then completing the pad formation, and finally assembling the built-up structure. This segmentation allows the surface treatment layer to be formed under controlled conditions before the structure undergoes deformation
2Productivity
If the gap between pads is shortened to increase pad density, then the productivity and integration of the circuit board is improved, but the surface treatment layer thickness and uniformity cannot be controlled accurately
Solution Approach 1:
The surface treatment layer is formed on the pad before the final pad structure is completed and before assembly. This preliminary action ensures that even when pads are closely spaced, each surface treatment layer can be accurately controlled in thickness and uniformity because it is formed on a stable substrate before deformation occurs
Data Source
AI summary
A circuit board structure and a manufacturing method thereof. The method includes: providing a temporary substrate; forming a dielectric layer having at least one through hole on the temporary substrate; forming a surface treatment layer on the temporary substrate in the at least one through hole; forming at least one pad on the surface treatment layer; forming a built-up structure on the dielectric layer; assembling the built-up structure to a substrate; removing the temporary substrate; and removing the dielectric layer.