Circuit Board Terminal Area Design for Impedance Matching
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing method of mounting circuit components on circuit boards using pin-shaped terminals inserted into through holes with conductive plating is costly and limits the arrangement of multiple terminals due to area constraints, making impedance matching challenging, especially in applications with antenna patterns.
Innovation Solution
A circuit board design where terminal areas project from the end face, covered with electrically conductive material on all sides, allowing them to be inserted into and soldered within through holes, eliminating the need for separate terminals and enabling closer pitch arrangements and impedance matching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a pin-shaped terminal is used and inserted into a through hole with conductive plating, then reliable electrical connection is achieved, but the cost increases due to requiring separate terminals
Solution Approach 1:
The invention merges the terminal function with the circuit board itself by forming a terminal area directly on the circuit board surface. The terminal area is created as an extended conductive region that integrates the mounting function into the board structure, eliminating the need for separate pin-shaped terminals while maintaining reliable electrical connection through soldering to the terminal area and through-hole plating
Solution Approach 2:
The circuit board is designed to serve multiple functions: it provides both the mounting substrate and the terminal structure itself. The terminal area on the circuit board performs the dual role of being both part of the board structure and the terminal for component mounting, allowing the board to universally serve as both support and electrical interface
2Reliability
If the terminal area is covered with electrically conductive material on all sides, then soldering area is increased for better connection, but the terminal length must be increased to satisfy soldering standards, which prevents fine pitch arrangement
Solution Approach 1:
The invention transitions from a one-dimensional terminal (pin extending in one direction) to a two-dimensional terminal area (conductive region on the board surface). By covering the terminal area with electrically conductive material on all sides including the top surface, the soldering area is expanded across multiple dimensions, allowing sufficient soldering coverage without requiring increased terminal length, thus enabling fine pitch arrangements
3Reliability
If separate pin-shaped terminals are used for mounting, then electrical connection is achieved, but the cost increases and impedance matching becomes difficult
Solution Approach 1:
The terminal function is merged into the circuit board structure itself. The terminal area is formed as an integrated part of the board with conductive material coverage, combining the functions of the board and separate terminal into a single unified structure, thereby reducing component count and manufacturing cost while maintaining electrical connection reliability
Solution Approach 2:
The invention changes the physical parameters of the terminal by creating a terminal area with controlled dimensions and conductive material coverage. By adjusting the terminal area size, shape, and conductive material thickness, the design achieves both cost reduction through integration and proper impedance characteristics for signal integrity
4Device complexity
If only front and back surfaces of the circuit board are solderable, then the structure is simple, but insufficient soldering area is achieved for reliable connection
Solution Approach 1:
The soldering surface is expanded from two-dimensional (front and back surfaces only) to three-dimensional coverage by adding side surface plating. The terminal area is covered with electrically conductive material on all sides including the top surface and lateral edges, creating a multi-faceted soldering surface that increases total soldering area while maintaining structural simplicity of the board itself
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces costs by eliminating the need for separate terminals, allows for denser terminal arrangements, and ensures effective soldering across all sides, facilitating impedance matching in circuit boards with antenna patterns.
Implementation Method 1
The terminal area has a plurality of sides covered with an electrically conductive material
Implementation Method 2
the terminal may be inserted into and soldered to the through hole
Data Source
AI summary
A circuit board includes a terminal area projecting from an end face of the circuit board. The terminal area is flush with a front side and a back side of the circuit board and has a thickness equal to the circuit board. The terminal area has a plurality of sides covered with an electrically conductive material, the sides including a first surface flush with a front side of the circuit board, a second surface flush with a back side of the circuit board, and a pair of side surfaces that intersect the first surface and the second surface.