Circuit Board Module Terminal Pad Segmentation Alignment
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Solution Overview
Problem
Conventional circuit board modules often fail to achieve satisfactory positional accuracy and parallelism between the terminal board and the circuit board, affecting the reliability of their connection.
Innovation Solution
The circuit board module design includes a terminal board with specific pad configurations on both surfaces, where the first pad column is larger than the second and third pad columns, and these columns are arranged symmetrically to improve alignment and bonding strength, enhancing positional accuracy and parallelism.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the terminal board is connected to the circuit board using conventional single pad column configuration, then the structure is simple, but the positional accuracy and degree of parallelism are insufficient
Solution Approach 1:
The single pad column is segmented into three separate pad columns (first, second, and third pad columns) arranged in the first direction. This segmentation allows each pad column to independently contribute to positioning accuracy, with the first pad column providing primary alignment and the second and third pad columns providing additional constraint points that enhance parallelism control.
Solution Approach 2:
The second and third pad columns act as intermediary elements between the first pad column and the terminal board's socket connection pads. These intermediary pad columns provide additional bonding points that mediate the alignment process, ensuring that the terminal board maintains both positional accuracy and parallelism relative to the circuit board during assembly and operation.
2Strength
If the pad area is reduced to minimize material usage, then the material consumption decreases, but the bonding strength is reduced
Solution Approach 1:
Different pad columns are assigned different pad areas based on their specific functional requirements. The first pad column, which provides the primary positioning function, is given a larger pad area to ensure strong bonding and accurate alignment. The second and third pad columns, which provide additional constraint and parallelism control, have smaller pad areas, optimizing material usage while maintaining overall bonding strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the self-alignment function and bonding strength between the terminal board and the circuit board, ensuring high positional accuracy and parallelism, thus enhancing the reliability of the connection.
Implementation Method 1
mutually opposing pads of the first pad column and the fourth pad column, the second pad column and the fifth pad column, and the third pad column and the sixth pad column are respectively bonded by a bonding material
Data Source
AI summary
A circuit board module is electrically connectable to a socket by inserting one end part thereof into the socket, and includes a circuit board and a terminal board having a first surface provided with a column of socket-connection pads and mounted on the surface of the circuit board at the one end part. The terminal board includes first, second, and third pad columns provided on a second surface of the terminal board opposite to the first surface. The circuit board includes fourth, fifth, and sixth pad columns respectively provided on the surface of the circuit board opposing the second surface of the terminal board, at positions opposing the first, second, and third pad columns of the terminal board, respectively.