Circuit Board Thermal Cutoff Using Memory Metal and Magnetic Release
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Solution Overview
Problem
The challenge of heat dissipation in high-density and thin electronic components leads to overheating, which can cause reliability issues and reduce the lifespan of circuit boards due to insufficient surface area for heat dissipation and heat transfer to the circuit board.
Innovation Solution
A circuit board design incorporating a temperature control element with memory metal layers and magnetic attraction parts that disconnects the electronic component from the wiring base upon overheating, using magnetic forces to create a circuit break and prevent damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronic components are made with high-density and thinner assembly, then the compactness and integration of the circuit board is improved, but the heat dissipation capability deteriorates due to insufficient surface area
Solution Approach 1:
The patent transitions from two-dimensional surface heat dissipation to three-dimensional heat dissipation by introducing heat dissipation holes that extend vertically through the circuit board. This allows heat to be dissipated from both the top and bottom surfaces simultaneously, effectively increasing the heat dissipation surface area without increasing the horizontal footprint, thus resolving the contradiction between component density and heat dissipation capability.
2Temperature
If heat is transferred to the circuit board, then the thermal coupling between component and board is improved, but the reliability and product life deteriorate due to thermal damage
Solution Approach 1:
The patent converts the harmful effect of heat transfer to the circuit board into a beneficial protective mechanism. Temperature control elements are designed to respond to excessive heat by changing their electrical resistance, which triggers a circuit break that disconnects power to the overheating component. Thus, the heat transfer that would normally cause damage is instead used to activate the protection mechanism, preventing thermal damage and improving reliability.
3Reliability
If a temperature control element is added to provide overheat protection, then the reliability is improved, but the device complexity increases
Solution Approach 1:
The patent merges the temperature control element with the existing circuit board structure by integrating it into the heat dissipation hole formation process. The temperature control element shares the same physical space and manufacturing steps as the heat dissipation structure, eliminating the need for separate protective devices. This integration maintains reliability through overheat protection while minimizing increases in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively protects against overheating by disconnecting the electronic component, improving reliability and extending the product's life by reducing thermal damage.
Implementation Method 1
The first magnetic attraction parts are disposed in the first memory metal layer. The second magnetic attraction parts are disposed in the second memory metal layer and correspond to the first magnetic attraction parts, respectively
Implementation Method 2
The temperature control element includes a first memory metal layer, a second memory metal layer
Data Source
AI summary
A circuit board includes a wiring base including pads, a temperature control element, flexible parts, conductive pillars and an electronic component disposed on the temperature control element. The temperature control element is disposed on the wiring base, forms a gap with the wiring base, and includes a first memory metal layer, a second memory metal layer fixed on the first memory metal layer, first magnetic attraction parts disposed in the first memory metal layer, and second magnetic attraction parts disposed in the second memory metal layer and corresponding to the first magnetic attraction parts, respectively. The flexible parts are disposed in the gap and correspond to the first magnetic attraction parts, respectively, and are electrically connected to the pads, respectively. The conductive pillars are disposed between the electronic component and the temperature control element, penetrate the second magnetic attraction parts, respectively, and are electrically connected to the electronic component.