Circuit Board Thermally Conductive Structure Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Multilayer circuit board technologies face challenges with heat management due to high-performance application processors, leading to increased circuit temperatures and potential warpage, noise, and inefficiencies in heat distribution.
Innovation Solution
A circuit board design incorporating a thermally conductive structure with cavities or recesses, integrated via holes, and specific metal patterns to enhance heat dissipation, using materials like invar and copper, and incorporating a primer layer for improved adhesion and interlayer bonding to efficiently distribute heat and reduce noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high-performance application processors are used to increase processing capabilities, then device performance is improved, but heat generation increases causing temperature rise and potential warpage
Solution Approach 1:
The patent extracts the heat dissipation function from the standard circuit board structure by introducing a dedicated thermally conductive structure with cavity that penetrates through the insulating part. This separate thermal management component is inserted into the insulating part to create an efficient heat transfer path from the application processor, allowing high-performance processing while actively managing the heat generated.
Solution Approach 2:
The patent employs composite material structure combining thermally conductive materials (such as metal alloys with copper content ≥60% or graphite) with insulating materials. The thermally conductive structure is integrated into the insulating part to form a composite assembly that simultaneously provides electrical insulation and thermal conduction pathways, enabling effective heat management in high-performance circuits.
2Ease of manufacture
If conventional circuit board structures are used, then manufacturing is simple, but heat distribution is inefficient leading to hotspots and warpage
Solution Approach 1:
The patent introduces a thermally conductive structure with cavity as an intermediary element between the heat source (application processor) and the heat dissipation path. This intermediary structure with its cavity design facilitates more efficient heat transfer by providing increased surface area and optimized thermal pathways, acting as a mediator that improves heat distribution without fundamentally complicating the overall manufacturing process.
Solution Approach 2:
The patent transitions from traditional planar heat dissipation to a three-dimensional thermal management solution. The thermally conductive structure with cavity that penetrates through the insulating part creates vertical heat transfer pathways, adding a dimensional aspect to heat dissipation that significantly improves thermal management efficiency while maintaining manufacturing feasibility.
3Temperature
If thermally conductive structure is inserted into insulating part, then heat dissipation is improved, but adhesion between components may be insufficient
Solution Approach 1:
The patent employs a primer layer as a sacrificial or consumable intermediate substance that facilitates strong adhesion between the thermally conductive structure and the insulating part. The primer layer, though potentially thin and simple in composition, provides crucial bonding functionality that ensures the structural integrity of the assembled components, allowing effective heat dissipation without compromising adhesion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces temperature variations, alleviates warpage, and improves heat distribution, enhancing the reliability and performance of the circuit board by rapidly transferring heat away from hotspots and reducing noise.
Implementation Method 1
a first thermally conductive structure including a cavity or a recess portion, wherein at least a portion of the first thermally conductive structure is inserted into an insulating part
Implementation Method 2
an adhesion improving portion on the surface of the first thermally conductive structure configured to increase adhesion between the first thermally conductive structure and the insulating part
Data Source
AI summary
A circuit board includes a first thermally conductive structure comprising a cavity or a recess portion. At least a portion of the first thermally conductive structure is inserted into an insulating part. An electronic device comprising a portion thereof inserted in the cavity or the recess portion.