Circuit Board Impedance Control via Non-Conductive Through Holes
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The impedance of the contact area between circuit board contact pads and signal terminals is lower than ideal, affecting signal transmission quality due to industry size constraints on these components.
Innovation Solution
Incorporating non-conductive through holes in the interval areas between adjacent signal and ground contact pads on the circuit board to adjust and enhance the impedance of the contact area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the size of contact pad and contact point is adjusted to improve impedance, then impedance matches ideal level, but industry agreement constraints prevent such adjustment
Solution Approach 1:
The patent introduces non-conductive through holes at specific locations (interval areas between contact pads and contact points) to locally modify the electrical characteristics. This allows impedance adjustment in specific regions without changing the overall size of contact pads or contact points, thereby maintaining compliance with industry agreements while achieving ideal impedance levels.
Solution Approach 2:
Instead of adjusting impedance by changing the size of contact pads or contact points (two-dimensional adjustment), the patent introduces non-conductive through holes that extend through the thickness of the circuit board (third dimension). This dimensional transition enables impedance control without modifying the planar dimensions constrained by industry standards.
2Reliability
If non-conductive through holes are added to adjust impedance, then signal transmission quality improves, but device structure becomes more complex
Solution Approach 1:
The patent utilizes non-conductive through holes (a form of porous structure) in the circuit board to modify electrical characteristics. These holes are filled with air or insulating material, creating a controlled impedance environment for signal transmission without requiring complex additional components or structures.
Data Source
AI summary
A circuit board includes a plurality of signal contact pads each electrically contacting a contact point of one of a plurality of signal terminals and a non-conductive through hole extending through the circuit board in an interval area between a pair of adjacent signal contact pads of the plurality of signal contact pads.