Circuit Board Transition Structure for Solderless 67 GHz Measurement
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Solution Overview
Problem
Existing circuit board devices face challenges in high-frequency signal measurements due to the need for costly connectors and parasitic effects that hinder accurate Thru-Reflect-Line calibration and measurement.
Innovation Solution
A circuit board device with a multi-layer structure featuring conductive layers and anti-pad regions optimized for impedance continuity, using conductive vias to surround pads and transmission lines, reducing parasitic effects and enabling low-cost, repeatable high-frequency signal measurements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If SMA connectors are used for low-frequency signal measurements, then the connector can be soldered to the circuit, but the connector cannot be reused and the soldering process adds complexity
Solution Approach 1:
The patent uses a solderless connector design that replaces expensive, non-reusable soldered SMA connectors with a disposable, low-cost connector that achieves reliable high-frequency connection without soldering. The connector is designed to be easily replaceable, embodying the disposable concept while maintaining connection stability through the optimized feed-in structure.
Solution Approach 2:
The patent extracts the soldering process from the connector installation, using a solderless spring-loaded mechanism that eliminates the need for soldering while maintaining reliable electrical connection. This extraction allows for easy connector replacement without thermal damage to the circuit board.
2Ease of operation
If solderless connectors are used for high-frequency signal measurements, then the connector can be reused, but parasitic effects in the feed-in area cause serious high-frequency reflections
Solution Approach 1:
The patent applies local quality optimization by creating a specialized feed-in structure with controlled impedance transition. The connector feed-in area features optimized trace geometry and spacing that locally compensates for parasitic effects, reducing reflections at the critical connection point while maintaining overall connector reusability.
Solution Approach 2:
The patent changes the geometric parameters of the transmission line in the feed-in area, including trace width, spacing, and length, to optimize impedance matching and minimize parasitic effects. These parameter adjustments reduce high-frequency reflections while preserving the solderless connector's reusability.
3Device complexity
If conventional transmission lines are used with solderless connectors, then the structure is simple, but reflection coefficients are high and return loss is poor
Solution Approach 1:
The patent segments the transmission line into distinct sections with different characteristics: a first section with optimized impedance for the connector interface and a second section transitioning to the standard circuit impedance. This segmentation allows each section to be optimized for its specific function, reducing overall reflections while maintaining structural simplicity.
Solution Approach 2:
The patent introduces a vertical dimension to the feed-in structure by using a multi-layer board configuration with the connector on one layer and optimized return paths on adjacent layers. This dimensional approach provides better impedance control and reduces parasitic effects without significantly increasing horizontal complexity.
4Measurement precision
If expensive high-frequency connectors are used for frequencies up to 67 GHz, then accurate measurements can be performed, but the cost increases significantly for multiple measurements
Solution Approach 1:
The patent employs a low-cost solderless connector design that replaces expensive precision SMA connectors for high-frequency measurements. While individual connectors are cheaper, their disposable nature allows unlimited replacements without the high cost of precision connectors, making multiple measurements economically viable while maintaining adequate measurement precision.
Solution Approach 2:
The patent creates an optimized feed-in structure that replicates the performance characteristics of expensive precision connectors through careful PCB layout and impedance control. This copying approach achieves comparable measurement accuracy at a fraction of the connector cost, enabling cost-effective high-frequency measurements.
Data Source
AI summary
A circuit board device includes a transition region that includes a first conductive layer at a first level, a second conductive layer at a second level, and conductive vias. The first conductive layer includes a pad connected to the solderless connector, a transmission line, and a first reference layer. The transmission line includes first and second segments. A second width of the second segment is the same as or less than a first width of the first segment. The first reference layer has a first anti-pad region for the pad and the transmission line disposed therein. In a plan view, the first anti-pad region surrounding the pad is completely located within a second anti-pad region of a second reference layer of the second conductive layer. The conductive vias are disposed between the first and second conductive layers and surround the pad.