Circuit Board Via Diameter Segmentation for Solder Control
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Solution Overview
Problem
Existing circuit boards face challenges in heat dissipation and solder flow management, particularly when mounting IC packages of different sizes, which can lead to reduced manufacturing yield due to solder protrusion and insufficient solder amount.
Innovation Solution
The circuit board design incorporates through vias of varying diameters, with smaller diameter vias (0.25 mm) in the overlapping region for the second IC package and larger diameter vias (0.3 mm) elsewhere, to manage solder flow and ensure adequate heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If through vias with uniform diameter are used across the circuit board, then manufacturing process is simplified, but solder protrusion occurs in overlapping regions and solder amount becomes insufficient in non-overlapping regions
Solution Approach 1:
The patent applies local quality by varying the diameter of through vias based on their location: smaller diameter (0.25mm) in overlapping regions where solder accumulation occurs, and larger diameter (0.3mm) in non-overlapping regions where more solder is needed. This localized differentiation resolves the contradiction by optimizing solder control for each specific region's requirements.
2Temperature
If larger diameter through vias are used for heat dissipation, then heat dissipation performance is improved, but solder protrusion increases due to larger opening area
Solution Approach 1:
The patent implements local quality by assigning different via diameters to different functional regions: smaller vias (0.25mm) in overlapping regions prevent solder protrusion, while larger vias (0.3mm) in non-overlapping regions provide sufficient heat dissipation. This spatially differentiated approach resolves the contradiction between heat dissipation performance and solder control.
Solution Approach 2:
The patent segments the through via population into two distinct groups based on location: overlapping region vias and non-overlapping region vias. Each segment has optimized diameter for its specific function, preventing solder protrusion in one segment while ensuring adequate heat dissipation in the other segment.
3Manufacturing precision
If smaller diameter through vias are used to prevent solder protrusion, then solder amount control is improved, but heat dissipation capability is reduced
Solution Approach 1:
The patent applies local quality by matching via diameter to regional requirements: smaller vias (0.25mm) in overlapping regions optimize solder control, while larger vias (0.3mm) in non-overlapping regions optimize heat dissipation. This localized optimization resolves the contradiction by ensuring each region receives the via size appropriate for its primary function.
Solution Approach 2:
The patent segments the circuit board into overlapping and non-overlapping regions, each with dedicated via sizes. This segmentation allows smaller vias to control solder in critical overlapping areas while larger vias provide sufficient heat dissipation in non-overlapping areas, resolving the trade-off between solder precision and thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses solder protrusion and ensures a sufficient solder amount for reliable mounting, thereby enhancing the manufacturing yield of the circuit board.
Implementation Method 1
Heat generated in the IC is conducted to a heat transfer pattern (thermal land) on the circuit board provided to be opposed to the heat dissipation plate. The heat conducted from the heat dissipation plate is dissipated to another layer of the circuit board via this through via.
Implementation Method 2
a resist opening portion is formed in a back surface thereof so that solder melting and flowing into the through via at the time of reflow mounting is absorbed by this resist opening portion
Data Source
AI summary
A circuit board includes a first surface having a first mounting region configured so that a first electronic part is mounted or mountable to the first mounting region, and a second surface having a second mounting region configured so that a second electronic part is mounted or mountable to the second mounting region, the second surface being different from the first surface, and a plurality of through vias penetrating through the circuit board, including at least a first through via and a second through via, wherein the circuit board includes an overlapping region in which the first mounting region and the second mounting region overlap each other as viewed from a direction perpendicular to the first surface, and wherein the first through via is arranged in the overlapping region.