Dual-Surface Circuit Board Via Signal Inversion
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Solution Overview
Problem
Existing circuit boards in image forming apparatuses face challenges in obtaining appropriate signal outputs due to insufficient consideration of logical values of control signals for electronic parts mounted on both surfaces of the circuit board.
Innovation Solution
A circuit board configuration with a first surface for mounting a first electronic part, a second surface for mounting a second electronic part, and a controller generating control signals with inverse logical values to control the output signals of both electronic parts, connected via a via for common wiring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic parts are mounted on both surfaces of the circuit board, then the functionality and control capability are improved, but the wiring complexity and area increase
Solution Approach 1:
The patent utilizes the third dimension (depth) by mounting electronic parts on both the front and back surfaces of the circuit board. This allows the controller to access and control multiple electronic parts with a single output terminal, effectively reducing the wiring area while maintaining enhanced functionality. The via holes provide vertical connectivity between surfaces, enabling compact signal routing.
Solution Approach 2:
The output terminal of the controller is designed to serve multiple functions by connecting to both the first electronic part on the front surface and the second electronic part on the back surface through via holes. This multi-functional terminal reduces the overall number of terminals needed, thereby decreasing wiring complexity while maintaining the ability to control multiple electronic parts.
2Adaptability or versatility
If electronic parts are mounted on both surfaces of the circuit board, then the functionality is improved, but the wiring area increases
Solution Approach 1:
By utilizing both surfaces of the circuit board for mounting electronic parts, the design effectively uses the Z-dimension (thickness direction) to reduce the XY-plane wiring area. The via holes provide short vertical interconnects that minimize the horizontal distance signals must travel between surfaces, thereby reducing overall wiring area while maintaining enhanced functionality.
3Reliability
If control signals with inverse logical values are used, then the signal output appropriateness is improved, but the control logic complexity increases
Solution Approach 1:
The controller is designed to output control signals with inverse logical values to the first and second electronic parts. This inversion approach ensures that when one electronic part is activated (high logic), the other is deactivated (low logic), and vice versa. This resolves signal conflicts and ensures appropriate signal outputs for complementary control scenarios, while the inversion logic is integrated into the controller's basic control architecture.
Data Source
AI summary
Disclosed is a circuit board comprising a first surface configured so that a first electronic part is mountable, a second surface different from the first surface, the second surface being configured so that a second electronic part is mountable, and a controller configured to generate a first control signal input to the first electronic part to control a logical value of an output signal output by the first electronic part; and a second control signal input to the second electronic part to control a logical value of the output signal output by the second electronic part; and a first via configured to connect a wiring to which the output signal from the first electronic part is output and a wiring to which the output signal from the second electronic part is output.