Circuit Board Via Pattern for Signal Crosstalk Reduction
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Solution Overview
Problem
Conventional electronic apparatuses face interference from electromagnetic noise and crosstalk due to dense and complex circuit layouts, and excessive wire lengths lead to signal transmission loss.
Innovation Solution
The electronic apparatus features a circuit board with conductive vias that form a mirror-symmetric pattern between the control device's signal contacts and the packaged electronic component's contact pads, reducing wire density and trace length to simplify the layout and minimize crosstalk.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the circuit layout is made dense and complex to reduce the size of the electronic apparatus, then the size of the electronic apparatus is reduced, but the electromagnetic noise and crosstalk interference increase
Solution Approach 1:
The patent utilizes the thickness direction (Z-axis) of the circuit board by placing the control device and packaged electronic component on opposite sides, allowing them to overlap in the thickness direction. This dimensional arrangement shortens the trace length required for electrical connection while maintaining a compact planar footprint, thereby reducing crosstalk without increasing the overall device size.
Solution Approach 2:
Instead of placing the control device and packaged electronic component on the same side of the circuit board as in conventional designs, the patent inverts the arrangement by positioning them on opposite sides. This inversion allows for shorter connection traces and reduced wire density, thereby minimizing electromagnetic noise and crosstalk while achieving compact dimensions.
2Device complexity
If the wire length between the integrated circuit device and the electronic component is increased to simplify the layout, then the layout complexity is reduced, but the signal transmission loss increases
Solution Approach 1:
The patent exploits the thickness direction of the circuit board to position the control device and packaged electronic component on opposite sides with overlapping projections. This dimensional approach enables direct vertical connections through the circuit board, minimizing trace length and reducing signal transmission loss while maintaining layout simplicity.
3Reliability
If the number of electrical contacts of an electronic component is increased to meet higher transmission speed and quality requirements, then the transmission speed and quality are improved, but the arrangement of solder balls and circuit layout become more dense and complex
Solution Approach 1:
The patent arranges the control device and packaged electronic component on opposite sides of the circuit board with overlapping projections in the thickness direction. This configuration allows multiple electrical contacts to be connected through short vertical traces, accommodating high-density contact requirements without increasing planar layout complexity.
Data Source
AI summary
An electronic apparatus and a circuit board thereof are provided. The electronic apparatus operates in cooperation with a packaged electronic component. The electronic apparatus includes a circuit board and a control device disposed on the circuit board. The circuit board includes a plurality of conductive vias passing therethrough, and the conductive vias includes a plurality of first conductive vias arranged respectively corresponding to the first contact pads of the packaged electronic component. The control device includes a signal contact array including a plurality of first signal contacts. When the packaged electronic component and the control device are respectively disposed on two opposite sides of the circuit board, the packaged electronic component and the control device at least partially overlap in a thickness direction of the circuit board, and the first signal contacts are respectively electrically connected to the first contact pads via the corresponding conductive vias.