Circuit Board Assembly With Through-Hole Vibration Isolation
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Solution Overview
Problem
Circuit boards vibrate due to the piezoelectric phenomenon of bypass elements like MLCCs, generating noise in the range of 20 Hz to 20 kHz, and existing methods to mitigate this, such as additional soldering or heat treatment, are costly and ineffective.
Innovation Solution
The circuit board assembly incorporates through-holes surrounding the vibration element, a cover with partition walls, and a heat sink to prevent vibration transmission and reduce noise, with optional tape for additional support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If soldering using an additional structure or heat treatment is applied on MLCC to reduce vibration, then vibration reduction may be achieved, but manufacturing cost increases and noise reduction effect is insignificant
Solution Approach 1:
The circuit board is segmented by introducing through-holes that pass through the board around the MLCC vibration element. This segmentation divides the continuous board structure into separate regions, preventing vibration transmission from the MLCC to the rest of the board, thereby reducing noise without requiring additional soldering structures or heat treatment processes
Solution Approach 2:
The harmful vibration is extracted or isolated from the main board structure by creating through-holes around the MLCC. The vibration path is removed from the continuous board, allowing the MLCC to vibrate without transmitting noise to the overall circuit board assembly, achieving noise reduction without additional manufacturing steps
2Reliability
If additional structures or heat treatment are applied to reduce MLCC vibration, then vibration may be reduced, but the manufacturing process becomes more complex and costly
Solution Approach 1:
The board structure is segmented into isolated vibration zones using through-holes positioned around the MLCC. This simple structural modification reliably prevents vibration transmission without introducing complex additional components or multi-step manufacturing processes
Solution Approach 2:
The through-holes in the circuit board automatically serve the dual function of electrical isolation and vibration isolation. The existing board structure modifies itself to provide noise reduction functionality without requiring separate vibration damping components or additional manufacturing operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively minimizes noise generation by preventing vibration propagation and absorption, enhancing manufacturing efficiency and reducing costs.
Implementation Method 1
the multi layer ceramic capacitor produces a piezoelectric phenomenon due to input of AC noises
Implementation Method 2
a through-hole which passes through from the one surface to the other surface on the opposite side from the one surface to prevent a vibration of the vibration element from being transmitted to the circuit board
Implementation Method 3
a cover which covers at least a portion of the circuit board to reduce a vibration of the circuit board caused by a vibration of the vibration element
Implementation Method 4
a heat sink which is disposed in close contact with the other surface of the circuit board on the opposite side from the one surface
Data Source
AI summary
A circuit board assembly including a circuit board, which has one surface on which circuit elements including a vibration element are mounted, and a cover, which covers at least a portion of the circuit board to reduce a vibration of the circuit board caused by a vibration of the vibration element. The cover includes a cover body spaced apart from the one surface and a partition wall protruding from a surface of the cover body, which faces the circuit board, to cover at least a portion of the vibration element. The partition wall presses the one surface.