Insulated Circuit Board Cooling Layout to Prevent Bonding Warp
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Solution Overview
Problem
The warping of insulated circuit boards during the bonding process due to differing linear expansion coefficients between the insulating plate, wiring board, and metal plate leads to positional deviations of semiconductor chips, reducing production yield and increasing thermal resistance, thereby deteriorating heat dissipation properties.
Innovation Solution
A semiconductor device manufacturing method involving the use of a heater with a flat surface for heating and a cooler with support portions to maintain the insulated circuit board in a downward convex state during cooling, preventing warping and ensuring proper alignment of semiconductor chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional heating and cooling methods are used during bonding, then the bonding process can be completed, but the insulated circuit board warps upward convexly due to differential contraction, causing positional deviations of semiconductor chips and reducing production yield
Solution Approach 1:
The patent applies preliminary anti-action by pressing the insulated circuit board downward convexly during the cooling process. This pre-applied counteracting force opposes the upward convex warping that would naturally occur due to differential contraction between the metal plate and insulating plate, thereby preventing positional deviations of semiconductor chips and maintaining manufacturing precision throughout the bonding process
2Reliability
If the insulated circuit board is allowed to warp upward convexly during cooling, then the bonding process can proceed, but the bonding member thickness increases and thermal resistance increases, deteriorating heat dissipation properties
Solution Approach 1:
The patent applies preliminary anti-action by maintaining the insulated circuit board in a downward convex state during cooling. This prevents the formation of excessive bonding member thickness that would occur with upward warping, ensuring uniform bonding member thickness and maintaining low thermal resistance for reliable heat dissipation properties
3Manufacturing precision
If the insulated circuit board is pressed downward during cooling, then warping is prevented and chip alignment is improved, but additional equipment complexity is required
Solution Approach 1:
The patent merges the heating and cooling equipment into a single integrated apparatus that performs both functions. The heating unit and cooling unit are combined in one device, allowing the insulated circuit board to be heated during bonding and then pressed downward during cooling without requiring separate equipment, thereby reducing overall device complexity while maintaining chip alignment accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces positional deviations and enhances heat dissipation by maintaining the integrity of the circuit board structure, improving production yield and thermal conductivity.
Implementation Method 1
a heater having a heating surface including a flat surface is used for performing the heating in a state in which a lower surface of the insulated circuit board is placed on the flat surface
Implementation Method 2
a cooler having a cooling surface including a pair of support portions is used for performing the cooling in a state in which lower surfaces of a pair of outer regions of the insulated circuit board are respectively placed in contact with the pair of support portions
Implementation Method 3
an insulating plate, a wiring board, and metal plate differ in linear expansion coefficient. In the process of heating and cooling for bonding semiconductor chips to the insulated circuit board with a bonding member, the metal plate on the back surface of an insulating plate contracts significantly
Data Source
AI summary
When a semiconductor unit is heated, a heater having a flat heating surface is used for performing heating in a state in which a lower surface of an insulated circuit board is placed on the heating surface. When the semiconductor unit is cooled, a cooler having a cooling surface including a pair of support portions is used for performing cooling in which a lower surface of a pair of outer regions of the insulated circuit board are respectively placed to be contact with the pair of support portions, and in which a central region between the pair of outer regions of the insulated circuit board is pressed downward so as to be downward convex.