Circuit Board Wiring Overlap Reduces Display Frame Area
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Solution Overview
Problem
Conventional display devices with full-monolithic circuit boards have an increased frame region due to the separate formation of external connection terminals and wiring regions, which hinders the reduction of size and weight in portable electronic devices.
Innovation Solution
The circuit board design includes wiring arranged in a layer lower than the external connection terminal to overlap with it, reducing the frame region area, and incorporates an anti-corrosion conductive film to prevent corrosion of the external connection terminal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the wiring is arranged in a separate region from the external connection terminal, then the corrosion of the external connection terminal can be prevented, but the area of the frame region increases
Solution Approach 1:
The patent merges the wiring region and external connection terminal region by allowing the wiring to extend into the external connection terminal region and overlap with it in the plan view. This integration enables the wiring to be positioned in a layer lower than the external connection terminal while sharing the same spatial footprint, thereby preventing corrosion through proper layer separation while minimizing the frame region area.
Solution Approach 2:
The patent resolves the spatial conflict by utilizing the vertical dimension (layer structure). The wiring is arranged in a layer lower than the external connection terminal, allowing both components to occupy the same planar region without physical interference. This vertical separation enables corrosion prevention through material isolation while maintaining compact horizontal footprint.
2Area of stationary object
If the wiring is arranged in a layer lower than the external connection terminal to overlap with it, then the frame region area is reduced, but the complexity of the multi-layer structure increases
Solution Approach 1:
The patent employs standard multi-layer PCB manufacturing techniques to create the layered structure. The lower layer wiring and upper layer external connection terminals use conventional fabrication processes, making the increased structural complexity manageable through established industrial methods rather than requiring novel manufacturing approaches.
3Device complexity
If the aluminum film is extended to the outside of the panel as an external connection terminal, then the connection is simplified, but the corrosion of the aluminum film occurs
Solution Approach 1:
The patent introduces an anti-corrosion conductive film as an intermediary layer between the aluminum wiring film and the external environment. This intermediate layer protects the aluminum film from corrosion while maintaining electrical conductivity, allowing the aluminum to be extended to the panel outside for simplified connections without suffering from corrosion issues.
Solution Approach 2:
The external connection terminal structure uses composite material construction with multiple conductive films (aluminum wiring film and anti-corrosion conductive film) stacked together. This composite structure combines the advantages of aluminum (conductivity, ease of connection) with the corrosion resistance of the anti-corrosion conductive film layer.
Data Source
AI summary
A circuit board includes a driver circuit for driving a pixel and an external connection terminal, on a substrate. The circuit board includes a wiring that is arranged just below the external connection terminal, and in a layer lower than the external connection terminal to overlap therewith.