Circuit Board Layout Using Zero-Ohm Pads for Higher Integration
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Solution Overview
Problem
The increasing number of electronic elements on display device circuit boards necessitates improved integration density without expanding the board area.
Innovation Solution
A circuit board design incorporating resistive pads with zero ohm resistance, connected by conductive patterns, allows for electronic elements to be placed on one surface while resistive pads are on the opposite surface, connected via conductive patterns, enhancing integration without increasing board area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the area of the circuit board is increased to mount more electronic elements, then the number of electronic elements increases, but the integration density does not improve
Solution Approach 1:
The patent utilizes the thickness dimension of the circuit board by placing resistive pads on the back surface (opposite surface) rather than only on the front surface with electronic elements. This allows electrical connections to be established through the board thickness, enabling more electronic elements to be mounted on the front surface without increasing the board area, thus improving integration density.
2Adaptability or versatility
If resistive pads are disposed on the same surface as electronic elements, then circuit option setting is enabled, but the available area for mounting electronic elements is reduced
Solution Approach 1:
The patent divides the circuit board into two functional surfaces: the front surface for mounting electronic elements and the back surface for placing resistive pads. This segmentation allows both functions to coexist without competing for the same space, maintaining full mounting area availability while enabling circuit option setting through the resistive pads on the opposite surface.
3Adaptability or versatility
If additional zero-ohm resistors are mounted on the circuit board for circuit option setting, then circuit adaptability is improved, but the number of components and manufacturing complexity increase
Solution Approach 1:
The patent merges the function of separate zero-ohm resistors with the circuit board structure itself by forming resistive pads directly on the board's back surface using conductive patterns. This integration eliminates the need for additional discrete zero-ohm resistor components, reducing component count and manufacturing complexity while maintaining circuit option setting capability.
Data Source
AI summary
A circuit board includes a board including a first surface and a second surface opposing the first surface, where the board includes at least one conductive layer and at least insulating layer, a plurality of electronic elements disposed on the first surface of the board, and a plurality of resistive pads disposed on the second surface of the board and electrically connected to at least one selected from the electronic elements. The resistive pads have a resistance of zero ohm.