Circuit Bonding Detection Device for IC Package Defect Monitoring
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Solution Overview
Problem
Conventional IC package methods, such as COG, face challenges in precision alignment and defect detection, leading to increased costs and risks of failed scrutiny due to manual inspection and potential deformation of conductive bumps during mounting.
Innovation Solution
A circuit bonding detection device comprising a substrate, sensors, and a detection unit that automatically detects deformation in contact pads and conductive bumps, transmitting a fault signal when deformation occurs, thereby reducing manual inspection and improving production coherence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual inspection is used to detect defective products, then the process is simple to implement, but the reliability of defect detection is low and production coherence is disrupted
Solution Approach 1:
The patent replaces manual visual inspection with an automated optical detection system that uses a light source and sensor to detect conductive bump deformation. This substitution of mechanical/manual inspection with an automated sensing system resolves the contradiction by providing reliable, consistent defect detection without disrupting production coherence.
Solution Approach 2:
The detection system is integrated directly into the mounting process, allowing the system to automatically detect and identify defective products during assembly. This self-service approach enables the production line to autonomously identify defects without external manual intervention, improving reliability while maintaining simplicity.
2Productivity
If precision alignment and manual testing are performed, then manufacturing accuracy can be maintained, but production efficiency decreases and costs increase
Solution Approach 1:
The patent performs deformation detection during the mounting process itself, rather than requiring separate post-assembly inspection steps. By integrating the optical sensor detection into the mounting workflow, the system maintains manufacturing precision while eliminating time-consuming separate testing phases, thereby improving production efficiency.
Solution Approach 2:
The patent replaces manual alignment verification and testing with an automated optical detection system that continuously monitors conductive bump deformation. This substitution enables real-time precision verification without interrupting the mounting process, resolving the contradiction between productivity and manufacturing precision.
3Strength
If conductive bumps are subjected to over-stress during mounting, then bonding strength may be improved, but deformation occurs and product quality decreases
Solution Approach 1:
The patent implements preliminary detection of conductive bump deformation during the mounting process using an integrated optical sensor system. By detecting deformation as it occurs, the system can identify excessive stress or misalignment before it causes permanent damage, allowing for corrective action that protects bonding strength while preventing deformation-related defects.
Solution Approach 2:
The detection system provides real-time feedback on conductive bump deformation status during mounting. This feedback mechanism allows the system to monitor bonding strength development while simultaneously detecting any deformation, enabling dynamic adjustment of mounting parameters to optimize both strength and integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables automated detection of defects, reducing production costs and the likelihood of failed scrutiny, and ensuring higher precision in circuit assembly processes.
Implementation Method 1
the detection unit receives a detection signal from the set of sensors and transmits a fault signal in response to detecting that the at least one contact pad of the first group and the corresponding conductive bump deforms and makes contact with the set of sensors
Data Source
AI summary
This invention provides a circuit bonding detection device, a detection method thereof and an electro-optical apparatus incorporating the circuit bonding detection device. The circuit bonding detection device includes a substrate, a circuit module, a set of sensors, and a detection unit. A plurality of contact pads is disposed on the substrate. The circuit module includes a plurality of conductive bumps corresponding to the contact pads. The sensors are disposed on two sides of at least one of contact pads or of the corresponding conductive bumps. The detection unit is electrically coupled with the set of sensors and transmits a fault signal when at least one of the contact pads and the corresponding conductive bumps deforms and contacts the sensors.