Injection-Molded Circuit Carrier With Underside Capacitive Sensor
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Solution Overview
Problem
Conventional injection-molded circuit carriers lack efficient integration of capacitive sensors, which are essential for applications like automotive engineering, due to limitations in terminal guidance and environmental protection of semiconductor bodies.
Innovation Solution
An injection-molded circuit carrier with a trough-shaped formation and metal surfaces on the underside, where printed conductors are guided from the inside to the outside and underside, forming capacitive sensors with wider metal surfaces for enhanced electrical connectivity and environmental protection of semiconductor bodies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional injection-molded circuit carriers are used with terminals guided on the outside, then the structure is simple, but capacitive sensors cannot be efficiently integrated
Solution Approach 1:
The patent transitions from guiding conductors only on the outside surface to utilizing the underside dimension as well. Printed conductors are guided from the inside to the underside via the cover surface, creating metal surfaces on the underside that serve as capacitive sensor elements. This dimensional expansion enables sensor integration without proportionally increasing complexity.
Solution Approach 2:
The circuit carrier is designed to serve multiple functions: it provides structural support for the semiconductor body, guides printed conductors for electrical connections, and creates large metal surfaces on the underside that function as capacitive sensor elements. This multi-functionality resolves the contradiction by making the same structure adaptable to sensing applications.
2Reliability
If terminals are guided on the outside of the circuit carrier, then the structure is simple, but electrical connection reliability is insufficient for capacitive sensors
Solution Approach 1:
The patent utilizes the underside of the circuit carrier as an additional dimension for conductor routing. Printed conductors are guided from the inside to the underside via the cover surface, creating reliable electrical connections to metal surfaces on the underside. This three-dimensional routing path improves connection reliability by providing dedicated sensor connection paths.
3Object-affected harmful factors
If standard circuit carrier design is used, then manufacturing is simple, but environmental protection of semiconductor body is insufficient
Solution Approach 1:
The semiconductor body is nested within the circuit carrier structure, with the frame enclosing the inner base region where the semiconductor body is mounted. The frame has a specific height greater than the semiconductor body thickness, creating a protective enclosure that shields the semiconductor body from environmental influences while maintaining manufacturing simplicity.
4Adaptability or versatility
If metal surfaces for capacitive sensors are formed, then sensor functionality is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent combines the formation of metal surfaces for capacitive sensors with the existing printed conductor routing process. The same printed conductors that provide electrical connections to the semiconductor body also serve to create the metal surfaces on the underside. This merging of functions achieves sensor functionality without adding separate manufacturing steps.
Solution Approach 2:
The circuit carrier structure itself serves dual purposes: it provides the mechanical support and electrical connections for the semiconductor body, and simultaneously creates the metal surfaces necessary for capacitive sensing. The frame and printed conductor system serve both structural and sensing functions, eliminating the need for separate sensor components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates the easy manufacturing of capacitive proximity switches with improved environmental protection and flexibility in design, enabling effective electrical connections for automotive applications.
Implementation Method 1
at least two metal surfaces are formed on the underside, which are each electrically connected to a printed conductor and are spaced a distance apart, the metal surfaces being designed to be significantly wider than the printed conductors for the purpose of forming a capacitive sensor
Data Source
AI summary
An injection-molded circuit carrier is provided that has an outside and an underside and an inner base region and a frame. The frame has an inside and a cover surface, so that the inner base region is enclosed in the manner of a frame, and multiple printed conductors are provided, which are spaced a distance apart. The printed conductors are guided at least partially from the inside to the underside via the cover surface and via the outside so that at least two metal surfaces are formed on the underside, which are each electrically connected to a printed conductor and are spaced a distance apart. The metal surfaces are designed to be significantly wider than the printed conductors for the purpose of forming a capacitive sensor.