Transparent Adhesive Decals for Circuit Component Footprints
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Circuit designers face challenges in incorporating circuit components into designs due to the difficulty in discerning and drawing their footprints and lead paths, which is time-consuming and requires expertise, and these designs often change during development, necessitating repeated measurements and research.
Innovation Solution
A circuit component decal comprising a transparent sheet with an adhesive, a removable cover, and an opaque circuit pattern that includes electronic component footprints and lead paths, allowing for easy integration and replacement of components without needing to draw new footprints and lead paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If circuit designers manually measure and draw footprints and lead paths from scratch, then circuit components can be incorporated into designs, but the process becomes time-consuming and requires specialized expertise
Solution Approach 1:
The patent uses pre-printed circuit component footprints and lead paths on transparent adhesive decals as copies of actual circuit components. Designers can directly transfer these pre-drawn footprints onto PCB layouts without manually measuring or drawing from scratch, significantly reducing design time and eliminating the need for specialized measurement skills.
Solution Approach 2:
The circuit component footprints and lead paths are pre-printed on the decals before use. This preliminary preparation of footprint data allows designers to simply apply the decals to their designs rather than creating footprints from scratch each time, streamlining the design process.
2Adaptability or versatility
If circuit designers manually research and draw new footprints when components change, then design updates can be made, but the process requires repeated measurements and research
Solution Approach 1:
When circuit components need to be replaced or updated, designers can simply swap the corresponding decal with another that has the desired footprint. This copy-and-replace approach eliminates the need to重新 measure, research, and draw new footpaths, making component changes straightforward and reducing process complexity.
3Loss of information
If circuit component footprints are not readily available, then circuit components can be incorporated into designs, but the footprints become difficult to discern and obtain
Solution Approach 1:
The patent creates visual copies of circuit component footprints by printing them directly onto transparent adhesive decals. These decals serve as tangible, easily discernible representations of footprints that can be visually inspected and transferred to PCB layouts, eliminating the need to search for or interpret abstract footprint data.
Solution Approach 2:
The use of transparent adhesive decals with printed footprints allows designers to visually overlay and inspect footprint information directly on the PCB layout. The transparency enables easy verification of footprint placement and dimensions, making footprint information readily available and easy to discern.
Data Source
AI summary
A circuit component decal comprising a transparent sheet and an opaque circuit pattern. The transparent sheet includes opposing top and bottom surfaces and a number of edges. The opaque circuit pattern includes an electronic component footprint and a number of circuit lead paths. The electronic component footprint includes a number of contact points representing the location of leads of the electronic component. The circuit lead paths extend from the contact points to the edges of the transparent sheet. The opaque circuit pattern corresponds to only a section of a complete circuit pattern and is configured to block energy from reaching a first portion of the intermediate substrate when the transparent sheet is positioned on the intermediate substrate so as to form the section of the complete circuit pattern.