Circuit Connection Module Thermal Bridge Design
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Solution Overview
Problem
Conventional circuit connection modules face challenges in effectively dissipating heat generated by electronic components due to the high thermal resistance of air, leading to insufficient heat dissipation.
Innovation Solution
A circuit connection module is designed with a thermally and electrically conductive electrically conductive member that includes a plate-shaped portion connected to a heat dissipation pad on the electronic component and a terminal portion, allowing for efficient heat dissipation through a thermally conductive path to the mating terminal and surrounding air.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat is dissipated from the outer surface of the electronic component into surrounding air, then the structure is simple, but the heat dissipation performance is insufficient due to large thermal resistance of air
Solution Approach 1:
The patent introduces an electrically conductive member with high thermal conductivity as an intermediary between the electronic component and the surrounding environment. This member serves as a thermal bridge that efficiently conducts heat away from the electronic component, replacing the inefficient air-based heat dissipation pathway while maintaining structural integration.
Solution Approach 2:
The electrically conductive member performs multiple functions simultaneously: it provides electrical connection between components and serves as a heat dissipation pathway. By combining electrical and thermal functions in a single element, the patent improves heat dissipation performance without significantly increasing structural complexity.
2Temperature
If a thermally conductive electrically conductive member is introduced to improve heat dissipation, then heat dissipation performance is improved, but the device complexity increases
Solution Approach 1:
The patent merges the electrical connection function and thermal conduction function into a single electrically conductive member. This integration eliminates the need for separate thermal management components, thereby improving heat dissipation efficiency while minimizing the increase in device complexity.
Solution Approach 2:
The electrically conductive member is designed to simultaneously provide electrical connectivity and thermal management. By making this single component multi-functional, the patent achieves effective heat dissipation without adding numerous separate components, thus limiting the increase in device complexity.
3Temperature
If the plate-shaped portion is directly connected to the heat dissipation portion, then thermal conduction is efficient, but thermal shock risk increases
Solution Approach 1:
The patent incorporates a curved coupling location between the plate-shaped portion and the heat dissipation portion. This curved transition reduces stress concentration and distributes thermal loads more evenly, thereby maintaining efficient thermal conduction while reducing the risk of thermal shock and improving reliability.
Solution Approach 2:
The curved coupling location acts as a buffer zone that anticipates and mitigates thermal shock before it reaches the critical connection points. By designing this gradual transition in advance, the patent protects the joint between components from sudden thermal stresses while preserving thermal conduction efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module achieves improved heat conduction and dissipation performance by utilizing a thermally conductive path with low thermal resistance, enhancing heat dissipation efficiency compared to air-based dissipation methods and reducing the risk of thermal shock through a curved coupling location.
Implementation Method 1
an electrically conductive member that is electrically connected to the electronic component and for electrically connecting to a mating terminal of the circuit connection module, said electrically conductive member being thermally conductive
Data Source
Figure 1
Figure 2
Figure 3A~3B
AI summary
A circuit connection module include a board, an electronic component mounted on the board, and an electrically conductive member connected to the electronic component so as to be thermally conductive. The electronic component includes a heat dissipation portion exposed on an outer surface of the electronic component. The electrically conductive member includes a plate-shaped portion connected to the heat dissipation portion so as to be thermally conductive, and a terminal portion in which one end is connected to the plate-shaped portion so as to be thermally conductive and electrically conductive and the other end is in contact with a mating terminal.