Circuit Contact Compensation for Chip Shift in Electronic Packaging
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Solution Overview
Problem
During the manufacturing process of electronic devices, chip shift due to process deviations or thermal expansion and contraction can misalign the circuit structure with the chip, affecting electrical performance.
Innovation Solution
An electronic device manufacturing method that involves transferring electronic elements onto a carrier board, forming an encapsulation layer, retrieving position information to detect shift amounts, and compensating the position of contact portions in the circuit structure to align with corresponding pads, thereby reducing misalignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If chip transfer or packaging is performed during manufacturing, then electronic elements can be assembled into the device, but chip shift occurs due to process deviation or thermal expansion and contraction causing misalignment between the circuit structure and the chip
Solution Approach 1:
The patent applies preliminary action by forming a compensation structure before the chip shift occurs. The compensation structure is created in advance with the ability to adjust its position, allowing it to compensate for future misalignment issues. This proactive approach enables the system to pre-establish the corrective mechanism that will address alignment problems without requiring rework after the shift occurs.
Solution Approach 2:
The patent utilizes parameter changes by making the compensation structure adjustable in position. The compensation structure can change its spatial parameters (position, orientation) to match the actual position of the chip after shift. This dynamic parameter adjustment allows the system to adapt to varying degrees of misalignment and maintain proper electrical connection despite manufacturing variations or thermal effects.
2Ease of manufacture
If the circuit structure is formed based on nominal chip position, then manufacturing is simplified, but misalignment occurs affecting electrical performance
Solution Approach 1:
The patent introduces an intermediary element - the compensation structure - that mediates between the fixed circuit structure and the shifted chip. This compensation structure serves as a buffer that can be positioned to bridge the gap caused by chip shift, ensuring electrical connection is maintained. The intermediary absorbs the misalignment error without requiring changes to either the circuit structure or the chip itself, thus maintaining manufacturing simplicity while improving reliability.
3Reliability
If alignment tolerance is reduced to ensure proper connection, then electrical performance improves, but manufacturing complexity and cost increase
Solution Approach 1:
The patent applies segmentation by dividing the alignment function into two separate components: the fixed circuit structure and the adjustable compensation structure. This segmentation allows the system to maintain simple manufacturing for the majority of components while introducing adjustability only where needed (in the compensation structure). The segmentation enables the system to achieve high alignment precision without making the entire manufacturing process complex, as only the compensation structure requires precise adjustment capability.
Data Source
AI summary
An electronic device including an electronic element, an encapsulation layer, a circuit structure, a bonding element, and a bolt is provided. The encapsulation layer surrounds the electronic element. The circuit structure is electrically connected to the electronic element. The bonding element is electrically connected to the electronic element via the circuit structure. The bolt is disposed between the circuit structure and the encapsulation layer. A manufacturing method of an electronic device is also provided.