Circuit Device Thermal Insulation for Control Element Protection
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Solution Overview
Problem
Circuit devices with heat dissipation members, conductors, circuit boards, and control elements arranged in a specific order often have a lower allowable temperature limit for circuit components due to heat conduction, restricting their operational temperature range.
Innovation Solution
Incorporating a heat insulation member, such as non-woven fabric with silica aerogel particles, placed opposite to the control element with the circuit board in between, to reduce heat conduction from the circuit component to the control element, and using a frame and lid member to contain heat within the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation member, conductors, circuit board, and control element are arranged in sequential order, then heat is conducted from circuit component to control element, but the allowable temperature limit of the circuit component is reduced due to heat transfer to the temperature-sensitive control element
Solution Approach 1:
A heat insulation member is introduced as an intermediary between the circuit board (which conducts heat from the circuit component) and the control element. This intermediary layer blocks the harmful heat conduction path while allowing the control element to remain electrically connected to the circuit board, thus resolving the contradiction between heat dissipation needs and control element protection
Solution Approach 2:
The device is segmented into distinct thermal zones: a heat generation zone (circuit component), a heat conduction path (conductor and circuit board), and a protected zone (control element separated by heat insulation member). This segmentation allows the hot zone to operate at high temperatures while the protected zone remains thermally isolated and cool
2Quantity of substance
If control element is placed close to circuit component for compact design, then device size is reduced, but control element temperature increases due to proximity to heat source
Solution Approach 1:
The heat insulation member serves as a thermal barrier that allows the control element to be positioned close to the circuit component for compact design while preventing excessive heat transfer. The intermediary layer enables spatial proximity without thermal coupling
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows circuit components to operate at higher temperatures without overheating the control element, effectively increasing the allowable temperature limit of the circuit components.
Implementation Method 1
a heat insulation member, such as non-woven fabric with silica aerogel particles, placed opposite to the control element with the circuit board in between, to reduce heat conduction from the circuit component to the control element
Implementation Method 2
the heat generated by the semiconductor switch is conducted by the conductors and the heat dissipation member in this order, and dissipates from the heat dissipation member
Data Source
AI summary
A plate-shaped conductor is placed on an upper surface of a plate-shaped heat dissipation member with an insulation member interposed therebetween. A heat insulation member is placed at a location that is different from a location where the conductor is placed, on the upper surface of the heat dissipation member. An FET is electrically connected to the conductor. When current flows through the FET, the FET generates heat. A microcomputer that outputs a control signal for controlling operation of the FET is connected to an upper surface of the circuit board and is located opposite to the heat insulation member with the circuit board interposed therebetween.