Circuit Device Thermal Insulation for Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Circuit devices with heat-generating components face limitations in temperature management due to the upper limit of the control element's temperature being lower than that of the component, leading to restricted operational temperatures.
Innovation Solution
The design includes a heat dissipation member with a first placement portion and an extension portion, a circuit board with a second placement and extension portion, and a control element placed on the second extension portion, creating an air layer that reduces heat conduction to the control element, allowing higher operational temperatures for the circuit component.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the control element is placed close to the heat-generating circuit component for compact design, then device compactness is improved, but the control element temperature increases excessively
Solution Approach 1:
The patent introduces an insulation member as an intermediary substance placed between the heat-generating circuit component and the control element. This insulation member acts as a thermal barrier that mediates the heat transfer process, allowing the control element to be positioned close to the circuit component while preventing excessive temperature rise. The insulation member specifically blocks the conduction path of heat from the circuit component to the control element, resolving the contradiction between compactness and temperature control.
2Reliability
If the upper limit temperature of the circuit component is restricted to protect the control element, then control element reliability is improved, but the circuit component cannot operate at its optimal temperature range
Solution Approach 1:
The insulation member serves as a thermal protective barrier that allows the circuit component to operate at higher temperatures without excessively heating the control element. By introducing this intermediary thermal insulation layer, the patent enables the circuit component to maintain optimal operating temperatures while the control element remains within its safe temperature range, thus resolving the contradiction between reliability and optimal operating temperature.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively increases the allowable temperature of the circuit component by minimizing heat transfer to the control element, ensuring the component operates within its higher temperature limits without overheating the control element.
Implementation Method 1
a first extension portion that extends from the first placement portion, the circuit board includes a second placement portion that is placed on the conductor and is arranged such that the conductor and the insulation member are sandwiched between the first placement portion and the second placement portion, and a second extension portion that extends from the second placement portion, is located opposite to and is spaced apart from the first extension portion
Data Source
AI summary
A conductor is placed on a first placement portion of a heat dissipation member with an insulation member interposed therebetween. An FET is electrically connected to the conductor. When current flows between the drain and the source of the FET, the FET generates heat. A second placement portion of a circuit board is placed on the conductor. The conductor and the insulation member are sandwiched between the first placement portion and the second placement portion. In the heat dissipation member, a first extension portion extends from the first placement portion, and in the circuit board, a second extension portion extends from the second placement portion. The first extension portion is located opposite to and is spaced apart from the second extension portion, and a microcomputer is placed on an upper surface of the second extension portion. The microcomputer outputs a control signal for turning the FET ON or OFF.