Circuit Device Pad Bonding Layout Adaptability

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Solution Overview

Problem

Existing circuit devices face challenges in simplifying layout changes for pad bonding, particularly in balancing high reliability requirements for in-vehicle use with cost and design complexity, as well as varying reliability needs across different applications.

Innovation Solution

The implementation of a circuit device design that includes first and second pad disposition regions with electrostatic protection circuits, allowing for a non-shrink version layout with pads in specific corner regions and a shrink version layout by removing these regions, enabling efficient switching between configurations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a non-shrink version layout with separate pad disposition regions is adopted for high reliability applications, then pad bonding reliability is improved, but device area increases and design complexity increases

Engineering Contradiction:

Improvepad bonding reliabilityVSAvoiddevice area

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent implements a switchable layout system that can dynamically transition between non-shrink and shrink versions. The pad disposition regions are designed to be removable, allowing the same device structure to adapt between high-reliability mode (with separate pad regions) and area-optimized mode (without separate pad regions), thus resolving the contradiction between reliability and area.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The device layout is segmented into modular components: electrostatic protection circuits are separated from main circuit blocks, and pad disposition regions are defined as distinct, removable segments. This segmentation allows the pad regions to be independently configured or removed based on reliability requirements, enabling the layout to switch between versions without redesigning the entire device.

Inventive Principle:

Principle #1Segmentation

2Reliability

If separate layouts are prepared for different reliability requirements, then reliability needs are met, but design complexity and cost increase

Engineering Contradiction:

Improvepad bonding reliabilityVSAvoiddesign complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent creates a universal layout template that serves multiple reliability requirements. The same base design can function as both a high-reliability version (with pad disposition regions) and a standard version (without them) by simply removing or retaining specific regions. This eliminates the need to maintain separate design files and processes for different reliability levels, reducing design complexity while meeting diverse reliability needs.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If electrostatic protection circuits are disposed in circuit disposition region, then electrostatic protection function is maintained, but layout flexibility is reduced

Engineering Contradiction:

Improveelectrostatic protection functionVSAvoidlayout flexibility

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The layout is segmented into independently configurable regions: electrostatic protection circuits are separated from main circuit blocks into distinct pad disposition regions. This segmentation allows the electrostatic protection regions to be removed or retained independently, providing layout flexibility while maintaining electrostatic protection functionality when needed for high-reliability applications.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design simplifies layout changes by allowing for adaptable pad bonding reliability, reducing design complexity and cost, while maintaining high reliability in critical applications and minimizing electrostatic protection function degradation.

Implementation Method 1

a first electrostatic protection circuit that is disposed in a circuit disposition region between the first pad disposition region and the second pad disposition region and is connected to the first pad

Methodology Applied

Scientific EffectElectrostatic discharge protection: Electrostatic Discharge

Data Source

PatentUS10685928B2Circuit device, oscillator, electronic apparatus, and moving object

Publication Date: 2020.06.16 SEIKO EPSON CORP

AI summary

A circuit device includes a first pad and a second pad that are disposed in a first pad disposition region along a first side; a third pad and a fourth pad that are disposed in a second pad disposition region along a second side which faces the first side; and a first to fourth electrostatic protection circuits that are disposed in a circuit disposition region between the first pad disposition region and the second pad disposition region and are connected to the first to fourth pads.