Circuit Device Thermal Isolation via Partitioned Housing

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Solution Overview

Problem

Existing circuit devices have their upper limit temperature for semiconductor switches limited by the heat resistance of control elements, leading to increased manufacturing costs when high heat resistance control elements are used.

Innovation Solution

A circuit device design where the circuit component is connected to a conductor on a heat dissipation member with an insulation layer, with a control element spaced apart from the heat dissipation member, and a housing member that includes a heat dissipation chamber allowing air flow, enabling effective heat dissipation without relying on high heat resistance control elements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the control element is arranged close to the heat dissipation member and conductor, then the device structure is compact, but the control element temperature increases due to heat conduction from the semiconductor switch

Engineering Contradiction:

Improvedevice structure compactnessVSAvoidcontrol element temperature

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The housing is divided into a housing chamber for the control element and a heat dissipation chamber for the heat dissipation member, with a partition plate separating them. This segmentation prevents heat conduction from reaching the control element while maintaining a compact overall structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The partition plate acts as an intermediary barrier between the heat dissipation member and the control element, blocking the thermal conduction path while allowing the device to remain compact through integrated design.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If a control element with high heat resistance is used, then the control element can withstand higher temperatures, but the manufacturing cost increases

Engineering Contradiction:

Improvecontrol element temperature toleranceVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The control element is extracted from the high-temperature zone by placing it in a separate housing chamber away from the heat dissipation member, allowing the use of standard, lower-cost control elements without requiring expensive high-heat-resistance components.

Inventive Principle:

Principle #2Taking out (Extraction)

3Temperature

If the control element is spaced apart from the heat dissipation member, then the control element temperature is reduced, but the device structure becomes more complex

Engineering Contradiction:

Improvecontrol element temperatureVSAvoiddevice structure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The housing chamber and heat dissipation chamber are merged into a single integrated housing structure with an internal partition, achieving thermal separation without requiring multiple separate components or complex assembly.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The partition plate serves multiple functions: it separates the control element from heat, provides structural support for the housing, and maintains the compact integrated design, reducing overall device complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design allows the circuit component to operate beyond the temperature limit of the control element, reducing manufacturing costs while maintaining effective heat dissipation through air convection, preventing overheating and ensuring reliable operation.

Implementation Method 1

heat generated by the semiconductor switch is conducted by the conductors and the heat dissipation member in this order, and dissipates from the heat dissipation member

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

a heat dissipation chamber through which air flows while being in contact with a heat dissipation surface of a second heat dissipation member

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 3

a conductor that is attached to an attachment surface of a first heat dissipation member with an insulation member interposed between the conductor and the attachment surface

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS11302607B2Circuit device

Publication Date: 2022.04.12 AUTONETWORKS TECH LTD

AI summary

A circuit device includes a circuit component electrically connected to a conductor and a first heat dissipation member includes an insulation member interposed between the conductor and the attachment surface. A control element outputs a control signal, a circuit board is spaced apart from the first heat dissipation member and the conductor. A housing member includes a housing chamber housing the circuit component and the circuit board, a heat dissipation chamber through which air flows while being in contact with a heat dissipation surface of a second heat dissipation member, and a partition plate has a plurality of communication holes placing the heat dissipation chamber and the housing chamber in communication with each other. A portion of the first heat dissipation member excluding the attachment surface and a portion of the second heat dissipation member excluding the heat dissipation surface are in contact with air outside the circuit device.