Circuit Device Case Member Warpage Prevention
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Solution Overview
Problem
The existing hybrid integrated circuit devices face warpage issues in the case member due to uneven thickness, temperature variations in the molding process, uneven pressure, and anisotropic fillers, which hinder effective sealing of the substrate.
Innovation Solution
A circuit device with a case member featuring four side wall parts forming a frame-like shape, where supporting parts are arranged at the corners to connect the inner walls continuously, preventing inward warpage by distributing stress evenly and maintaining uniform thickness across the side wall parts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the case member is formed by injection molding with a frame-like shape, then it can provide a structure for sealing the circuit board, but warpage occurs in the side wall parts due to uneven thickness, temperature, pressure, and anisotropic fillers
Solution Approach 1:
The patent applies local quality by varying the thickness of the side wall parts non-uniformly. Specifically, the side wall parts have different thicknesses at different locations, with thicker regions positioned at areas more prone to warpage during injection molding. This localized thickness variation compensates for the uneven cooling and pressure distribution, preventing inward warpage while maintaining the overall frame-like structure for sealing.
2Quantity of substance
If the side wall parts are made thinner to reduce material usage, then manufacturing cost decreases, but warpage becomes more severe
Solution Approach 1:
The patent implements local quality by creating non-uniform thickness distribution in the side wall parts. Rather than uniformly thinning all areas, the design maintains adequate thickness at critical locations prone to warpage while reducing material in less critical areas. This selective thickness optimization prevents excessive warpage while minimizing overall material consumption.
3Stability of the object's composition
If the case member thickness is increased to prevent warpage, then shape stability improves, but manufacturing complexity and material usage increase
Solution Approach 1:
The patent applies local quality by implementing thickness variation only where needed in the side wall parts, rather than uniformly increasing thickness throughout the entire case member. This localized approach prevents warpage at critical locations while maintaining simplicity in other areas, thus improving shape stability without proportionally increasing overall structural complexity or material usage.
Data Source
AI summary
The present invention provides a circuit device in which warpage of a case member is prevented. The circuit device of the present invention includes: a circuit board having on an upper surface thereof a built-in hybrid integrated circuit constituted by a conductive pattern and a circuit element; a case member including four side wall parts forming a frame-like shape and being in contact with the circuit board so as to form on the upper surface of the circuit board a space in which the circuit element is sealed; and a lead being fixed to a pad composed of the conductive pattern and extending to the outside. The circuit device of the present invention is further provided with a supporting part arranged at a corner of the case member so as to make continuous inner walls of the respective side wall parts with each other.