Circuit Element Transfer to Portable Device Shell
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Solution Overview
Problem
Conventional methods for manufacturing circuit elements in portable electronic devices require numerous components and assembly procedures, leading to high costs, restricted design flexibility, and increased product size due to the need for complex assembly and component arrangement.
Innovation Solution
Integrating circuit elements directly onto the shell of portable electronic devices using methods like injection molding or hot stamping, where the circuit elements are formed on a thin film and transferred onto the shell, reducing the need for assembly components and procedures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If circuit elements are manufactured separately and assembled into the portable electronic device, then the circuit elements can be produced with standard manufacturing processes, but the assembly requires many components and procedures increasing cost and time
Solution Approach 1:
The patent merges the circuit element manufacturing process with the shell molding process by incorporating a transfer film containing circuit elements into the shell molding cavity. This integration eliminates separate assembly operations, reducing both component quantity and assembly complexity while maintaining standard manufacturing capabilities for circuit element production.
Solution Approach 2:
The circuit elements are pre-formed on a transfer film before the molding process. This preliminary preparation allows the circuit elements to be ready for direct integration into the shell without requiring separate assembly steps, thereby reducing assembly complexity while maintaining ease of manufacture through pre-standardized circuit element fabrication.
2Ease of manufacture
If many assembly components are used for circuit elements, then the circuit elements can be assembled with standard components, but the assembly time increases making product cost expensive
Solution Approach 1:
The patent combines multiple assembly operations into a single molding process. The transfer film containing circuit elements is placed in the molding cavity, and the shell is molded in one operation, eliminating sequential assembly steps and significantly reducing assembly time while maintaining ease of manufacture through integrated processing.
Solution Approach 2:
Circuit elements are pre-positioned on the transfer film before molding, so that during the single molding operation, they are automatically integrated into the shell structure. This preliminary arrangement eliminates the need for time-consuming post-assembly operations while maintaining ease of manufacture through standardized pre-preparation.
3Ease of manufacture
If a large amount of assembly components is used, then the circuit elements can be assembled with necessary components, but the produce size cannot be reduced and design flexibility is restricted
Solution Approach 1:
The patent integrates circuit elements directly into the shell structure through the transfer film method, eliminating the need for separate assembly components. This integration reduces the overall produce size by removing unnecessary intermediate components and enables greater design flexibility as circuit elements can be positioned anywhere on the shell surface without being constrained by standard assembly layouts.
Solution Approach 2:
The transfer film is pre-configured with circuit elements in desired positions before molding. This preliminary arrangement allows for customized circuit element placement on the shell without being restricted by standard assembly component arrangements, thereby enhancing design flexibility while reducing produce size through direct integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces assembly time and costs, enhances design flexibility, and allows for a more compact product design by eliminating the need for separate assembly components and enabling circuit elements to be placed on any surface of the shell.
Implementation Method 1
the circuit element is transferred onto the shell by an injection molding method
Implementation Method 2
the circuit element is transferred onto the shell by a hot stamping method
Data Source
AI summary
A portable electronic device and a transferring method of a circuit element thereof are provided. The portable electronic device comprises a main body and a circuit element. The main body has a shell and a control element by a print way. The circuit element is integrated with the shell by transferring and is electrically connected with the control element.