Circuit Emulation Board Independent Interconnection Interfaces
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Solution Overview
Problem
The complexity of emulated circuits often requires multiple circuit boards, but the limited number of channels or signal paths on shared communication buses restricts the number of signals that can be exchanged or monitored, limiting the effectiveness of circuit emulation systems.
Innovation Solution
The implementation of circuit boards with multiple interconnection interfaces that provide independent signaling paths, allowing for structural stackability and expandability, enabling the coupling of multiple boards without relying on a common communication bus, thereby increasing the number of independent signaling channels and scalability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple circuit boards are used to emulate complex circuits, then the emulation capacity and functionality are improved, but the limited number of channels on shared communication buses restricts the number of signals that can be exchanged
Solution Approach 1:
The system divides the communication architecture into multiple independent interconnection interfaces (first interconnection interface and second interconnection interface) on each circuit board. Each interface provides separate signaling paths, eliminating the bottleneck of shared communication buses. This segmentation allows multiple circuit boards to be stacked and interconnected with sufficient signaling capacity for complex circuit emulation.
2Adaptability or versatility
If multiple circuit boards are coupled together, then the emulation system can handle more complex circuits, but the shared communication bus limits the expandability and stackability of the system
Solution Approach 1:
Each circuit board is equipped with multiple interconnection interfaces that can serve multiple functions: connecting to different circuit boards, providing independent signaling paths, and enabling both horizontal and vertical system expansion. This multi-functionality allows the system to scale flexibly without being constrained by a single shared communication bus architecture.
3Device complexity
If a shared communication bus is used to interconnect circuit boards, then the system structure is simplified, but the number of independent signaling paths is limited
Solution Approach 1:
The system transitions from a single-dimension shared bus architecture to a multi-dimensional interconnection structure with multiple independent interfaces. Each interface provides separate signaling paths, creating additional dimensions for signal transmission. This dimensional expansion allows numerous independent signaling channels while maintaining a structured and organized interconnection architecture.
Data Source
AI summary
An apparatus for circuit emulation may include a first circuit board, one or more circuit emulation resource on the first circuit board, a first interconnection interface on the first circuit board, and a second interconnection interface on the first circuit board. The first circuit board may include conductive wiring paths. The circuit emulation resource is on the first circuit board and coupled with a portion of the conductive wiring paths, with each circuit emulation resource being configured to emulate a portion of an electronic circuit by receiving input signals and producing output signals in response to the input signals. The first interconnection interface is on the first circuit board and coupled with at least a first portion of the circuit emulation resource, The first interconnection interface may be configured to couple with an interconnection interface of a second circuit board having a second group of conductive wiring paths and having a second group of circuit emulation resources. The second interconnection interface is on the first circuit board and coupled with at least a second portion of the at least one circuit emulation resource. The second interconnection interface may be configured to couple with an interconnection interface of a third circuit board having a third group of conductive wiring paths and having a third group of circuit emulation resources.