Circuit Film Bonding Pad Layout for High-Resolution Displays
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Solution Overview
Problem
Existing display devices face challenges in achieving high-resolution and high-frequency displays while maintaining adequate spacing between bonding pads to reduce interference and improve image quality.
Innovation Solution
The display device incorporates a circuit film with input and output pads arranged in two rows, increasing the gap size between bonding pads without expanding the circuit film width, thereby improving image quality and process capability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the number of signal lines and power lines is increased to support high-resolution and high-frequency display, then the display resolution and frequency are improved, but the gap size between bonding pads decreases
Solution Approach 1:
The bonding pads are rearranged from a conventional single-row or scattered layout to a two-row configuration. This dimensional reorganization allows signal lines to be routed more efficiently between the rows, increasing the gap size between adjacent bonding pads while accommodating the same or greater number of signal lines and power lines for high-resolution display.
Solution Approach 2:
The bonding pad arrangement is segmented into two distinct rows, separating input pads and output pads into organized groups. This segmentation creates clearer spatial zones that reduce interference between adjacent bonding pads while maintaining adequate spacing, thus supporting high-frequency operations without compromising the gap size.
2Speed
If the number of bonding pads is increased to support more signal lines, then the display frequency is improved, but the gap size between bonding pads decreases
Solution Approach 1:
By transitioning to a two-row bonding pad configuration, the patent creates additional spatial dimensions for organizing multiple bonding pads. This allows more pads to be accommodated with increased spacing between them, supporting higher display frequencies while maintaining the required gap size to minimize interference and crosstalk between adjacent high-speed signal lines.
3Object-affected harmful factors
If the gap size between bonding pads is increased to reduce interference, then the image quality is improved, but the width of the circuit film increases
Solution Approach 1:
The two-row arrangement of bonding pads optimizes the spatial distribution of pads across the circuit film width. By organizing pads into two rows with appropriate spacing, the design achieves adequate gap sizes for reducing interference while controlling the overall width of the circuit film through efficient use of the available two-dimensional space.
Solution Approach 2:
The bonding pads in different rows can be assigned different functions (input vs. output pads), allowing local optimization of the gap sizes based on specific signal requirements. This enables targeted interference reduction where needed while maintaining compact overall dimensions of the circuit film.
Data Source
AI summary
Disclosed is a display device in which a gap size between bonding pads disposed on a circuit film is increased even though the number of signal lines for driving high-resolution and high-frequency display and the number of power lines for low-speed operation increase. The display device includes a display panel; a printed circuit board; and a circuit film disposed between and connected to the display panel and the printed circuit board, wherein the circuit film includes an input side bonding area connected to the printed circuit board and an output side bonding area connected to the display panel, wherein the input side bonding area includes a plurality of input pads connected to the output side bonding area, wherein the plurality of input pads are arranged in two rows.