Circuit Assembly Inductor Heat Dissipation via Through Hole Protrusion
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Solution Overview
Problem
Conventional circuit assemblies face challenges in heat dissipation, especially when a metal bus bar is not present, leading to increased temperatures and potential performance deterioration of electronic components, and the use of synthetic resin bases further reduces heat conductivity.
Innovation Solution
A circuit assembly design featuring a circuit board with through holes for receiving protrusions on a heat dissipation plate, allowing for efficient heat transfer from inductors and magnetic cores to the plate, which can be compactly arranged vertically to reduce space requirements and minimize rattling due to vibration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If no bus bar is disposed on the circuit board, then the device complexity is reduced, but the heat dissipation performance deteriorates
Solution Approach 1:
The patent introduces a receiving protrusion as an intermediary component that bridges the heat dissipation plate and the inductor. This protrusion penetrates through the circuit board to directly contact the inductor, enabling efficient heat transfer without requiring a bus bar structure. The intermediary component resolves the contradiction by providing thermal contact while maintaining structural simplicity.
Solution Approach 2:
The receiving protrusion extends in the vertical dimension through the circuit board thickness, creating a three-dimensional heat transfer path. This dimensional approach allows direct thermal contact between the heat dissipation plate and inductor, bypassing the need for planar bus bar connections and achieving effective heat dissipation with simpler structure.
2Reliability
If a base made of synthetic resin is provided between circuit board and core, then the electrical insulation is improved, but the heat conductivity deteriorates
Solution Approach 1:
The patent applies local quality by providing thermal contact only in the specific region where the receiving protrusion contacts the inductor, while maintaining electrical insulation through the circuit board substrate. This localized thermal pathway allows efficient heat transfer at the contact point without requiring the entire base to have high thermal conductivity, thus resolving the contradiction between insulation and heat conduction.
3Area of stationary object
If the coil is disposed vertically with respect to the circuit board, then the area required on the circuit board is reduced, but the stability against vibration deteriorates
Solution Approach 1:
The receiving protrusion is nested within the through hole of the circuit board, creating a stable mechanical connection that anchors the vertically disposed coil. This nesting structure provides vibration resistance by mechanically securing the coil in place, resolving the stability issue while maintaining the space-saving vertical configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves excellent heat dissipation and compactness while stabilizing the inductors, reducing rattling and maintaining effective thermal contact even with non-flat surfaces.
Implementation Method 1
the receiving protrusion can be in heat transfer contact with the coil or the core member... the heat generated from the coil and the core member can be efficiently transferred to the heat dissipation plate
Data Source
AI summary
A circuit assembly includes: a circuit board; an inductor that is disposed on the circuit board, and that includes a coil including a winding portion made by winding a winding wire, and a core member; and a heat dissipation plate that is disposed on the opposite side of the surface of the circuit board on which the inductor is disposed, wherein a through hole is provided in a region of the circuit board that corresponds to the inductor, and a receiving protrusion that penetrates the through hole and protrudes to a surface side of the circuit board on which the inductor is disposed, and that is in heat transfer contact with the coil and the core member is provided in a region that corresponds to the through hole in the heat dissipation plate.