Circuit Insulation Structure for Thermal Stress Crack Resistance
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Solution Overview
Problem
The reliability of electronic devices is compromised due to cracking, damage, or delamination of insulation layers caused by large differences in thermal expansion coefficients between conductive and insulation layers in circuit structures during heating processes.
Innovation Solution
A circuit structure design featuring a first insulation layer with a specific opening and a second insulation layer having a lower Young's modulus, where the second insulation layer is disposed within the first opening, and a conductive connection layer connects the conductive layers across these layers, with the dimensions of the second opening and its distance from the outer surface conforming to a specific ratio to enhance structural strength and reduce stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional circuit structure with uniform insulation layers is used, then the manufacturing process is simple, but the insulation layers are susceptible to cracking, damage or delamination due to thermal expansion differences during heating processes
Solution Approach 1:
The patent divides the insulation structure into multiple segments: a first insulation layer, a second insulation layer with different Young's modulus, and a third insulation layer. This segmentation allows each layer to be optimized for specific functions - the second layer with lower Young's modulus acts as a stress buffer zone to prevent cracking and delamination of the first insulation layer during thermal expansion, while maintaining overall structural integrity
Solution Approach 2:
The patent applies local quality by creating a stress buffer zone specifically at the location where thermal stress is most critical - between the conductive connection layer and the first insulation layer. The second insulation layer is positioned locally to absorb thermal expansion stress, while other regions maintain their original structural properties for electrical functionality
2Reliability
If the Young's modulus of the second insulation layer is made lower to reduce stress, then the risk of cracking and delamination is reduced, but the structural support strength may be compromised
Solution Approach 1:
The patent changes the physical parameter of Young's modulus for the second insulation layer, making it lower than that of the first and third insulation layers. This parameter change allows the second layer to deform more easily under thermal stress, absorbing expansion forces and preventing cracking in the first insulation layer, while the overall multi-layer structure maintains sufficient support strength
Solution Approach 2:
The patent creates a composite insulation structure combining three different insulation layers with different Young's moduli. This composite structure leverages the advantages of each layer - the first layer provides electrical insulation, the second layer with lower Young's modulus provides stress buffering, and the third layer provides structural support, achieving both crack resistance and structural integrity
3Reliability
If the opening dimensions and positioning are optimized to distribute stress, then the structural integrity is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent optimizes specific geometric parameters including the width W and length L of the opening in the second insulation layer, as well as the thicknesses of all three insulation layers. These parameter optimizations are designed to distribute thermal stress uniformly across the structure, reducing peak stress concentrations that would lead to cracking, while maintaining manufacturability through reasonable tolerance ranges
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the structural strength and supportability of the circuit structure, effectively reducing the risk of cracking and delamination, thereby enhancing the reliability of electronic devices by distributing stress and maintaining structural integrity under thermal variations.
Implementation Method 1
The conductive layers and the insulation layers in the circuit structure are susceptible to cracking, damage or delamination of the insulation layer due to large differences between the thermal expansion coefficients of the conductive layers and the insulation layers
Data Source
AI summary
An electronic device includes a circuit structure including: a first insulation layer including a first opening; a second insulation layer disposed in the first opening and including a second opening; a conductive connection layer disposed in the second opening; and a first conductive layer and a second conductive layer respectively disposed on a surface and another surface of the first insulation layer. The first and the second conductive layer are electrically connected through the conductive connection layer, and the Young's modulus of the second insulation layer is less than the Young's modulus of the first insulation layer. In a cross-section of the electronic device, a center of the second opening and an outer surface of the second insulation layer are separated by a first distance X1, and a maximum width W of the second opening and the first distance X1 conform to the following formula:1.5W≦X1<3W.