Circuit Layer Manufacturing on Bezel Flat Region
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing assembly design of tablet computers, which includes a control circuit board with a substrate, limits the slim design and flexibility due to excessive thickness and requires costly and time-consuming screw fixation and grounding methods to prevent EMI and ESD damage.
Innovation Solution
A circuit layer manufacturing method where the circuit layer is directly formed on the flat metal region of the front bezel, omitting the substrate, using processes like resin coating, etching, and through hole grounding, and integrating metal and plastic portions via insert molding or punching/casting for reduced thickness and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a control circuit board with substrate is used, then the circuit board can be fixed and grounded, but the overall thickness increases and structural flexibility is limited
Solution Approach 1:
The patent extracts and removes the substrate from the traditional circuit board structure, retaining only the essential circuit layer functionality. The circuit layer is directly formed on the flat metal region of the front bezel, eliminating the need for a separate substrate and thereby reducing overall thickness while maintaining electrical functionality.
Solution Approach 2:
The patent merges the circuit board assembly with the front bezel structure by directly forming the circuit layer on the flat metal region of the bezel. This integration eliminates the need for separate mounting components and reduces the overall assembly thickness while maintaining structural integrity.
2Reliability
If conductive fabric, copper foil, or aluminum foil is attached to the control circuit board for grounding, then EMI and ESD damage is prevented, but component cost increases
Solution Approach 1:
The front bezel is designed to serve multiple functions: it provides the structural frame, contains the flat region for direct circuit layer formation, and acts as the grounding element. By making the bezel itself conductive and integrating it into the circuit layer assembly, the patent eliminates the need for separate grounding materials like conductive fabric, copper foil, or aluminum foil, thereby reducing component costs while maintaining EMI and ESD protection.
3Strength
If the control circuit board is fixed onto the front bezel in a screw locking manner, then the circuit board is securely attached, but the assembly process becomes time-consuming and strenuous
Solution Approach 1:
The circuit layer is directly formed on the flat metal region of the front bezel through processes such as printing or deposition, merging the circuit board creation process with the bezel manufacturing process. This integration eliminates the need for separate attachment operations like screw locking, thereby significantly improving assembly speed and productivity while maintaining secure attachment through direct integration.
4Strength
If a substrate is used in the control circuit board, then the circuit layer can be supported, but the overall thickness exceeds 2.5 mm
Solution Approach 1:
The patent extracts and removes the substrate from the circuit board assembly, retaining only the circuit layer which is directly formed on the flat metal region of the front bezel. This elimination of the substrate reduces the overall thickness to below 2.5 mm while the flat metal region of the bezel provides the necessary structural support for the circuit layer.
Data Source
AI summary
A circuit layer manufacturing method is applied to a portable computer. The portable computer includes a front bezel, a display module, and a back cover. The front bezel is connected to the back cover for containing the display module. The front bezel includes a metal portion. The metal portion has a flat region corresponding to a side of the back cover. The circuit layer manufacturing method includes forming at least one control circuit layer assembly on the flat region, grounding the control circuit layer assembly to the flat region, and forming a protection layer on the control circuit layer assembly. The control circuit layer assembly includes an insulation layer and a control circuit layer. The control circuit layer is electrically connected to the display module. The insulation layer is formed between the control circuit layer and the flat region for being alternately stacked with the control circuit layer.