Display Panel Circuit-Layer Electrodes for Durable Connections

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing display panels face reliability issues due to the degradation of connection electrodes, which affect the performance and longevity of the display devices.

Innovation Solution

The display panel design incorporates a multi-layered structure for connection electrodes, featuring aluminum conductive layers separated by silicon-based inorganic and organic sub-insulating layers, enhancing the reliability and durability of electrical connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a single-layer conductive structure is used for connection electrodes, then the manufacturing process is simpler, but the reliability and durability of electrical connections deteriorate

Engineering Contradiction:
Improvereliability of connection electrodesVSAvoidstructure complexity of connection electrodes
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The connection electrode is divided into multiple conductive layers (first conductive layer and second conductive layer) separated by insulating layers. This segmentation allows each layer to perform specific functions: the first conductive layer provides initial electrical connection, while the second conductive layer enhances durability and resistance to degradation, thereby improving overall reliability without requiring a completely complex redesign

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The connection electrode uses composite material construction with alternating conductive and insulating layers. The insulating layers (comprising inorganic materials like silicon dioxide and organic materials like polyimide) are interspersed between conductive aluminum layers, creating a composite structure that combines the electrical conductivity of aluminum with the protective and insulating properties of the layered materials, thus enhancing reliability

Inventive Principle:
Principle #40Composite materials

2Duration of action of stationary object

If aluminum conductive layers are used without protective layers, then the manufacturing process is simpler, but the durability and resistance to degradation worsen

Engineering Contradiction:
Improvedurability of connection electrodesVSAvoidmanufacturing complexity of connection electrodes
Core Design Contradiction:
Duration of action of stationary objectVSEase of manufacture

Solution Approach 1:

The insulating layers are formed between the conductive aluminum layers during the manufacturing process, providing protective coverage before the aluminum layers can be exposed to degrading environmental factors. This preliminary protective action prevents oxidation and other forms of degradation, extending the durability of the connection electrode

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The insulating layers act as intermediary protective barriers between the aluminum conductive layers and the external environment. These intermediary layers (comprising inorganic and organic materials) mediate the interaction between the aluminum and external factors such as moisture and oxygen, preventing direct contact and the resulting degradation, thus enhancing durability without requiring complex protective measures

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS20250338741A1Display panel and manufacturing method for the same
Publication Date: 2025.10.30 SAMSUNG DISPLAY CO LTD
  • US20250338741A1 patent drawing
  • US20250338741A1 patent drawing
  • US20250338741A1 patent drawing

AI summary

A display panel that includes a circuit layer and a light emitting element on the circuit layer is provided. The circuit layer includes a semiconductor pattern, a first insulating layer including a first contact hole configured to expose a portion of the semiconductor pattern, a plurality of first connection electrodes on the first insulating layer and electrically connected to the semiconductor pattern through the first contact hole, and a second insulating layer configured to cover the plurality of first connection electrodes and on the first insulating layer. Each first connection electrode includes a first and second conductive layer. The second insulating layer includes a first sub-insulating layer between the first conductive layers adjacent to each other, and a second sub-insulating layer disposed on the first sub-insulating layer.