Circuit Location Identifier Layer for Faster Defect Inspection
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Solution Overview
Problem
Existing electronic apparatus, such as silicon-based devices, face challenges in locating defective circuits due to repetitive and complex patterns in metal layers, which complicates visual inspection and identification of faults.
Innovation Solution
The implementation of a location identifier layer with a repetitive pattern, such as a metal mesh, that includes section labels like symbols, letters, and numbers to mark physical locations, simplifying the identification and location of circuit components and defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional visual inspection methods are used to locate defective circuits, then inspection can be performed without additional structures, but the repetitive and complex patterns in metal layers complicate visual inspection and reduce identification accuracy
Solution Approach 1:
The patent introduces location identifier layers as intermediary structures between the metal layers and the defective circuits. These identifier layers contain distinctive patterns and symbols that serve as visual mediators, making it easier to locate defects by providing clear reference points that contrast with the complex metal layer patterns. The identifier layers act as a bridge between the complex circuit structure and the inspection process.
2Productivity
If location identifier layers with distinctive patterns are added to simplify defect location, then visual inspection efficiency improves, but device structure and manufacturing complexity increase
Solution Approach 1:
The patent divides the location identification function into separate, modular identifier layers that can be independently designed and manufactured. Each identifier layer contains specific patterns or symbols that mark particular locations, allowing the inspection process to be segmented into locating identifier patterns and then identifying defects relative to those markers. This segmentation improves efficiency while managing complexity through modularity.
Solution Approach 2:
The location identifier layers are formed in advance during the manufacturing process, before final inspection occurs. By pre-establishing the reference patterns and symbols on the apparatus, the inspection process benefits from having ready-made visual cues without requiring complex real-time analysis. This preliminary action of placing identifiers simplifies the subsequent defect location task.
Data Source
AI summary
An apparatus includes a substrate; circuit components disposed on the substrate; and a location identifier layer over the circuit, wherein the location identifier layer includes one or more section labels for representing physical locations of the circuit components within the apparatus.