Circuit Member Bonding Structure for Smaller Electronic Substrates
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Solution Overview
Problem
Existing electronic components face challenges in downsizing while maintaining the reliability of the bonding between the electronic substrate and the circuit member, as reducing the width of the peripheral region decreases the bonding strength, and existing adhesive solutions fail to withstand shear stress and vertical forces.
Innovation Solution
The electronic component design includes a circuit member extending beyond the edge of the electronic substrate, a connecting member for electrical connection, an adhesive member between the circuit member and package member, and an optional opposing substrate bonded with the electronic substrate, ensuring the adhesive member covers the package member's side face to enhance bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the width of the peripheral region on the electronic substrate is minimized to decrease the size of the electronic substrate, then the area of the external connection terminal is decreased, but the bonding strength between the external connection terminal and the circuit member is decreased
Solution Approach 1:
The adhesive member extends not only in the planar direction but also vertically to cover the side face of the package member, transitioning from a two-dimensional bonding area to a three-dimensional bonding structure. This vertical extension provides additional bonding area that compensates for the reduced planar bonding area, allowing the electronic substrate to be downsized while maintaining bonding strength.
Solution Approach 2:
The bonding structure uses a composite approach by combining the adhesive member that bonds both the circuit member and the package member's side face, creating a multi-layer bonding system. This composite bonding structure distributes the bonding load across multiple interfaces, enhancing overall bonding strength despite reduced terminal area.
2Reliability
If the adhesive member is disposed between the circuit member and the package member to improve bonding reliability, then the bonding strength is improved, but the adhesive member is peeled off when shear stress is applied in the vertical direction
Solution Approach 1:
The adhesive member covers the side face of the package member in the vertical direction, creating a three-dimensional bonding structure. This vertical coverage distributes shear stress across a larger surface area and creates a more robust bonding interface that resists peeling forces better than a purely planar adhesive layer.
Solution Approach 2:
The adhesive member is pre-applied to cover the side face of the package member before the circuit member is positioned. This preliminary bonding preparation ensures that when vertical forces are applied, the adhesive member is already in place to distribute and resist the shear stress, preventing peeling.
3Device complexity
If a gap is formed between the bonding portion and the package member without the adhesive member, then the structure is simpler, but the circuit member is easily peeled off when pulled in the vertical direction
Solution Approach 1:
The adhesive member is selectively applied only to the side face of the package member where it is most needed for structural support, rather than applying it universally throughout the entire bonding interface. This targeted approach provides the necessary bonding strength while minimizing unnecessary material usage and structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the adhesive strength and reliability of the bonding between the circuit member and electronic substrate, allowing for further downsizing of the electronic substrate while maintaining robust connections.
Implementation Method 1
an adhesive member that is disposed between the circuit member and the package member, and joins the circuit member to the package member; and the adhesive member covers the side face of the package member
Data Source
AI summary
An electronic component comprising: an electronic substrate that includes an electronic element and a first connection terminal a package member that is disposed on the electronic substrate; and a circuit member that includes a second connection terminal, wherein the circuit member is disposed between the package member and the electronic substrate, and extends from the position between the package member and the electronic substrate outward beyond the edge of the electronic substrate; the electronic component includes a connecting member that is disposed between the circuit member and the electronic substrate, and electrically connects the second connection terminal and the first connection terminal, an adhesive member that is disposed between the circuit member and the package member, and joins the circuit member to the package member; the connecting member, the circuit member, and the adhesive member are located between the package member and the electronic substrate.