Circuit Module Identification Code Formation
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Solution Overview
Problem
Existing methods for managing circuit modules face challenges such as increased size due to space requirements for identification codes, difficulty in reading codes within resin-sealed modules, and reliability issues at the substrate-resin interface, which hinder defect traceability and analysis.
Innovation Solution
The solution involves forming a first identification code using partial electrode or resist layer formation on the module substrate's surface, eliminating the need for additional space and allowing code formation during electrode or resist layer creation, and providing a second identification code on the external surface for enhanced module identification, enabling easier reading and traceability within resin-sealed modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If identification codes are provided on circuit modules using conventional methods, then module identification and traceability are enabled, but module size increases due to additional space requirements
Solution Approach 1:
The identification code is merged with the electrode patterns by forming the code as conductive lines that connect functional electrodes or extend from them. This integration eliminates the need for separate identification code structures, thereby maintaining module identification capability while avoiding additional space consumption.
Solution Approach 2:
The conductive lines serving as identification codes are designed to perform dual functions: they act as both functional electrodes for electrical connections and as identification markers for module tracking. This multi-functionality reduces the overall component count and space requirements on the module surface.
2Length of stationary object
If identification codes are provided inside resin seals to maintain thin module profile, then module thickness is reduced, but code readability for defect analysis becomes difficult
Solution Approach 1:
The identification code is extracted from the interior of the resin seal and placed on the external surface of the module. This extraction allows the code to remain accessible for optical reading during defect analysis while the resin seal maintains its protective and space-saving function without obscuring the identification marker.
3Manufacturing precision
If separate processes are used to form identification codes, then code precision can be optimized, but manufacturing complexity and process steps increase
Solution Approach 1:
The identification code formation is merged with the existing electrode pattern formation process. The same photolithography and etching steps used to create functional electrodes are also used to create the identification code conductive lines, thereby maintaining code precision while eliminating the need for separate code formation equipment and processes.
Data Source
AI summary
Circuit modules including identification codes and a method of managing them are provided. A module substrate includes signal input output terminals and outer ground terminals provided at the peripheral portions of a surface which becomes a mounting surface when the circuit module is completed. An inner-ground-terminal formation area surrounded by the signal input output terminals and the outer ground terminals includes a plurality of inner ground terminals arranged in a matrix of rows and columns. One of the edge portions is a direction identification area. The inner ground terminal is not provided in the direction identification area, and a first identification code having information about the position of the module substrate is provided in the direction identification area.