Circuit Module Columnar Conductor Layout Freedom
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing circuit modules have limited degree of freedom in layout of external connection terminals, which hinders miniaturization due to the integral manufacturing of metal pins and requires high positional accuracy during transfer, making it difficult to achieve both high arrangement density and reliable connections.
Innovation Solution
A circuit module design featuring a substrate with a first columnar conductor and a plate-like conductor forming an integrated member, where the first columnar conductor is directly connected to the wiring pattern or electronic component without solder or adhesive, and both are embedded in resin layers, allowing for high degree of freedom in external connection terminal layout and improved connection reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal pin is manufactured as an integral member with shaft portion and plate-like portion, then connection reliability is improved, but degree of freedom in layout of external connection terminal is limited
Solution Approach 1:
The metal pin is divided into two separate components: a columnar conductor (shaft portion) and an external connection terminal (plate-like portion). These are manufactured separately and then connected through bonding or welding processes, allowing independent optimization of each component's position and structure while maintaining connection reliability.
2Reliability
If shaft portion is made thick to withstand transfer load, then transfer reliability is improved, but circuit module miniaturization is hindered
Solution Approach 1:
By separating the shaft portion from the external connection terminal, the shaft can be optimized for minimal thickness required for electrical connection and structural support during assembly, while the terminal portion can be independently sized for connection reliability. This eliminates the need for the shaft to be oversized to withstand transfer loads.
Solution Approach 2:
The shaft portion is temporarily fixed to a support body before transfer, and the external connection terminal is pre-assembled and positioned. This preliminary positioning ensures accurate placement without requiring the shaft itself to be thick enough to withstand transfer loads independently.
3Manufacturing precision
If high positional accuracy device system is used for transfer, then transfer precision is improved, but device complexity and cost increase
Solution Approach 1:
The external connection terminal is pre-assembled and positioned on the support body before the actual transfer process. This preliminary positioning simplifies the transfer requirements, as the terminal is already in its final position, reducing the need for high-precision transfer equipment.
Solution Approach 2:
A support body is introduced as an intermediary platform for assembling and positioning the external connection terminal before transfer to the substrate. This mediator simplifies the transfer process by providing a stable reference frame, reducing the complexity requirements of the transfer device system.
Data Source
AI summary
A circuit module (100) includes a substrate (1), on one principal surface of which a first wiring pattern (2) is provided, first electronic components (3-6) constituting a first electronic circuit together with the first wiring pattern (2), a plurality of connection conductors (8), a plurality of external connection terminals, a first resin layer (9), and a second resin layer (12). At least one of the plurality of connection conductors (8) includes a first columnar conductor (8a) extending in a normal line direction of the one principal surface of the substrate (1), and a plate-like conductor (8b) extending in a direction parallel to the one principal surface of the substrate (1). At least one of the plurality of external connection terminals is a second columnar conductor (11) extending in the normal line direction of the one principal surface of the substrate (1).


