Circuit Module Interlayer Conductor Stiffness Gradient
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Solution Overview
Problem
Existing circuit modules face damage to the connecting portions between interlayer connection conductors and inner conductive layers due to ultrasonic bonding processes, which can lead to electrical disconnection and warpage.
Innovation Solution
The circuit module design incorporates a multilayer body with interlayer connection conductors having distinct regions of varying Young's modulus, where the first region has a higher stiffness for supporting mounting electrodes and the second region has a lower stiffness to absorb ultrasonic vibrations, thereby reducing damage to connecting portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If ultrasonic bonding technology is used to bond solder bumps and IC connection terminals, then bonding strength is improved, but damage to the connecting portions between support vias and via connection terminals occurs
Solution Approach 1:
The interlayer connection conductor is designed with different Young's modulus values in different regions: a first region with higher Young's modulus for structural support, and a second region with lower Young's modulus to reduce ultrasonic vibration transmission to the connecting portions, thereby protecting against damage while maintaining bonding strength
Solution Approach 2:
The Young's modulus parameter of the interlayer connection conductor is changed spatially, creating a gradient structure where the first region has a higher Young's modulus and the second region has a lower Young's modulus, optimizing both structural support and vibration damping properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces or prevents damage to the connecting portions between interlayer connection conductors and inner conductive layers, minimizing the risk of electrical disconnection and warpage in the circuit module.
Implementation Method 1
ultrasonic vibrations are transmitted to the IC connection terminals and support vias and are thus applied to the boundaries between the support vias and via connection terminals
Implementation Method 2
A Young's modulus of the second region is lower than a Young's modulus of the first region
Data Source
AI summary
In a circuit module, a mounting electrode is located on a positive main surface of a resin layer positioned farther toward a positive side of a Z axis than other resin layers. An inner conductive layer overlaps the mounting electrode. An end of a first interlayer connection conductor on the positive side contacts the mounting electrode. An end of the first interlayer connection conductor on a negative side of the Z axis contacts the inner conductive layer. A product includes a connector bonded to the mounting electrode. The first interlayer connection conductor includes first and second regions provided in a direction toward the negative side in this order. A material of the first region is the same as that of the mounting electrode. A Young's modulus of the second region is lower than that of the first region.