Circuit Module Electrode Structure Without Grinding Exposure
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Solution Overview
Problem
Existing circuit modules require a grinding step to expose electrodes, which decreases productivity.
Innovation Solution
A circuit module design where the second electrode is covered by an insulator, with at least a portion of the first side surface exposed to facilitate electrical connection without grinding, allowing for symmetrical or asymmetrical structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a grinding step is used to expose the second electrode from the upper main surface of the board module, then electrical connection can be achieved, but productivity decreases
Solution Approach 1:
The second electrode is designed to extend beyond the upper main surface of the board module in advance, before assembly with the electronic component. This preliminary exposure eliminates the need for post-assembly grinding operations, maintaining electrical connection reliability while significantly improving manufacturing productivity by removing a time-consuming processing step
2Reliability
If the second electrode is exposed from the upper main surface, then electrical connection is enabled, but the manufacturing process becomes more complex
Solution Approach 1:
The electrode extension is incorporated into the board module design from the beginning, allowing electrical connection to be achieved through simple assembly rather than requiring complex grinding and precision alignment operations during manufacturing
Solution Approach 2:
The board module is designed with the second electrode as a separate extendable element that can be independently positioned and connected to the electronic component, simplifying the overall manufacturing process by breaking down the connection challenge into manageable segments
Data Source
AI summary
A circuit module includes a circuit board that includes a circuit board body and a conductor, the circuit board body including a first upper end surface and a first lower end surface situated side by side in an upward direction and a downward direction, the conductor being provided at the first upper end surface, an insulator at the first upper end surface, a first electrode including a second upper end surface, a second lower end surface, and a first side surface, and electrically connected to the conductor, the second upper end surface and the second lower end surface being situated side by side in the upward direction and the downward direction, the first side surface being connected to the second upper end surface, and an electronic component including an electronic component body and a second electrode and located above the insulator. The second upper end surface is covered by the insulator, and the second electrode is electrically connected to the first electrode as a result of at least a portion of the first side surface being exposed from the insulator.