Circuit Module Mounting Error Detection via Exposed Metal Pins
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Solution Overview
Problem
There is a need to easily determine whether a mounting error has occurred in the energy storage element within the three-dimensional package structure of a circuit module, as existing technologies lack effective methods for error detection.
Innovation Solution
A circuit module design featuring a substrate module with insulating members and metal pins, where the electronic component is mounted with conductive joining members that expose specific portions to facilitate visual inspection and prevent mounting errors by balancing surface tension, ensuring accurate positioning and reducing the likelihood of the 'tombstone phenomenon'.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the energy storage element is mounted on the semiconductor package using conventional methods, then the three-dimensional package structure is formed, but it becomes difficult to determine whether a mounting error has occurred
Solution Approach 1:
The patent applies visual differentiation through color or appearance changes. The exposed portion of the metal pin is designed to have a different appearance (exposed metal surface) compared to the insulating member, creating a visual contrast that enables easy detection of mounting errors. When the electronic component is correctly mounted, the exposed portion should be obscured; any visible exposed portion indicates a mounting error.
Solution Approach 2:
The patent creates a visual copy or representation of the mounting status through the exposed portion. The exposed portion serves as an indicator that replicates the mounting state - its visibility directly corresponds to whether the electronic component is properly mounted, providing an immediate visual copy of the mounting correctness without requiring complex inspection equipment.
2Ease of manufacture
If the electronic component is mounted without directional indicators, then the assembly process is simplified, but mounting errors cannot be easily detected
Solution Approach 1:
The patent introduces asymmetry through the directional exposure of the metal pin. The exposed portion is positioned at a specific direction relative to the electronic component's mounting orientation. This asymmetric configuration provides built-in directional information - the exposed portion naturally indicates the correct mounting direction, eliminating the need for additional markers or complex positioning systems while ensuring accurate orientation.
3Shape
If the metal pin is completely covered by the insulating member, then the appearance is cleaner, but the exposed portion cannot serve as a mounting error indicator
Solution Approach 1:
The patent applies local quality by creating a specific exposed portion of the metal pin that protrudes from the insulating member in a controlled manner. Instead of completely covering or fully exposing the metal pin, only a specific local portion is exposed, serving the dual purpose of maintaining overall appearance uniformity while providing a functional indicator for mounting error detection. The exposed portion is strategically positioned to indicate mounting status without compromising the overall aesthetic.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables easy detection of mounting errors and suppresses their occurrence, ensuring accurate positioning and reducing the height of the circuit module while preventing displacement due to surface tension imbalances.
Implementation Method 1
The first conductive joining member joins the first exposed portion and the left projecting portion to each other
Data Source
AI summary
A circuit module comprises a substrate module, an electronic component, and a first conductive joining member. The substrate module includes a circuit substrate having an upper main surface and a lower main surface, an insulating member covering the upper main surface of the circuit substrate, an insulating member covering the upper main surface of the circuit substrate, and a first metal pin that passes through the insulating member parallel to a vertical axis and is electrically connected to the circuit substrate. The first metal pin has a first exposed portion. The first exposed portion is exposed from the insulating member to face a right direction. A first outer electrode has a left projecting portion projecting in a left direction from the left surface. A first conductive joining member joins the first exposed portion and the left projecting portion to each other.