Circuit Module Metal Plate Layout for High-Current Capacitor Cooling

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Solution Overview

Problem

Circuit modules with capacitors as electrode terminals face significant heat generation issues when handling large currents, limiting their effectiveness in DC/DC converter circuits.

Innovation Solution

A circuit module configuration where a metal plate is connected to the substrate and in contact with the capacitor's electrodes, allowing increased current flow and reducing heat generation by using the metal plate as an external terminal.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If a capacitor is used as an electrode terminal to achieve miniaturization, then the module size is reduced, but heat generation increases when handling large currents

Engineering Contradiction:
Improvemodule sizeVSAvoidheat generation
Core Design Contradiction:
Volume of moving objectVSTemperature

Solution Approach 1:

The electrode terminal is segmented into two functional parts: the capacitor provides the terminal function for small currents, while a separate metal plate is introduced to handle large currents. This segmentation allows each component to optimize its function without compromising the other.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A metal plate is introduced as an intermediary component between the capacitor and the external circuit. The metal plate serves as a current distributor, directing small currents through the capacitor and large currents through itself, thereby preventing excessive heat generation in the capacitor while maintaining miniaturization benefits.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Power

If the capacitor electrode thickness is increased to handle large currents, then allowable current increases, but the capacitor size increases

Engineering Contradiction:
Improveallowable currentVSAvoidcapacitor size
Core Design Contradiction:
PowerVSVolume of moving object

Solution Approach 1:

The metal plate acts as an intermediary that bears the burden of handling large currents, allowing the capacitor to maintain its compact size with thinner electrodes. The metal plate's superior current-carrying capacity compensates for the reduced electrode thickness.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The system changes the current distribution parameters by introducing a dual-path configuration: one path through the capacitor for small currents and another path through the metal plate for large currents. This parameter change allows the capacitor to operate within safe current limits while the overall system handles large currents effectively.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for reduced or prevented heat generation in capacitors, enhancing their performance in high-current applications by increasing allowable current and improving heat dissipation.

Implementation Method 1

a metal plate connected to the substrate, that is in contact with the second electrode portion and the third electrode portion

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS11973421B2Circuit module including metal plate in contact with electrode portions
Publication Date: 2024.04.30 MURATA MFG CO LTD
  • US11973421B2 patent drawing
  • US11973421B2 patent drawing
  • US11973421B2 patent drawing

AI summary

A circuit module includes a substrate, a DC/DC converter mounted on the substrate, and a capacitor including a pair of electrodes each including an upper electrode portion facing the second main surface, a lower electrode portion opposing the upper electrode portion, and a side-surface electrode portion connecting the upper electrode portion and the lower electrode portion. The circuit module includes metal plates connected to the substrate and exposed to the outside. The metal plates are in contact with the lower electrode portion and the side-surface electrode portion. The metal plates are in contact with the lower electrode portion and the side-surface electrode portion.