Circuit Module Recessed Shielding for Miniaturization
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor package designs face challenges in miniaturization due to lower cavity formation accuracy on the side surface of substrates, leading to increased dead space and peeling issues with the electrically conductive shield portion.
Innovation Solution
A circuit module design featuring a recess on the side surface of a sealing resin covered with an electrically conductive film, which is difficult to peel off, eliminating the need for a recess on the substrate and ensuring stable electrical connection without dead space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a cavity is formed on the side surface of the substrate to achieve electrical connection, then electrical connection between electrode and shield portion is achieved, but manufacturing precision is lower and dead space increases
Solution Approach 1:
The invention moves the cavity formation from the substrate side surface to the sealing resin side surface. This dimensional relocation allows the cavity to be formed in a region where higher precision can be achieved, eliminating the manufacturing precision problems associated with substrate cavity formation while maintaining electrical connection functionality.
Solution Approach 2:
The invention extracts the cavity formation process from the substrate and relocates it to the sealing resin. This separation allows the cavity to be formed in an independent region with different manufacturing characteristics, achieving both electrical connection and higher precision without interfering with substrate integrity.
2Reliability
If a cavity is formed on the side surface of the substrate, then electrical connection is achieved, but dead space increases interfering with miniaturization
Solution Approach 1:
By relocating the cavity from the substrate region to the sealing resin region, the invention utilizes previously unused space in the sealing resin area. This dimensional relocation eliminates dead space in the substrate region, enabling better space utilization and circuit module miniaturization while maintaining electrical connection.
3Reliability
If shield portion covers the outer surface of molded portion, then electrical shielding is achieved, but peeling occurs
Solution Approach 1:
The invention introduces the sealing resin as an intermediary layer between the substrate and the shield portion. The cavity formed in the sealing resin allows the shield portion to be properly anchored and connected to the electrode through the sealing resin, preventing peeling while maintaining electrical shielding functionality.
Data Source
AI summary
A circuit module (101) includes a circuit board (1) having a main surface (1u), an electronic component (3) mounted on the main surface (1u), and a sealing resin (4) covering at least part of the electronic component (3) on the main surface (1u). A recess (7) is formed on at least part of a side surface (11) of the sealing resin (4). At least the recess (7) is covered with an electrically conductive film (6).