Circuit Module Resin Film Segmentation for Burr Prevention
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Solution Overview
Problem
The existing circuit modules face the risk of failure due to the adhesion of burrs, which can lead to short circuits when the excess conductor film adheres to the circuit module during the metallizing process and peeling off from the base, causing issues with the reliability of electronic apparatus.
Innovation Solution
The circuit module design includes a substrate with inner conductors, electronic components sealed by resin layers, and a conductor film applied on the outer and side surfaces, featuring a resin film with strategically placed gaps and projections to prevent the adhesion of excess conductor film, ensuring the conductor film is broken during peeling, thus preventing burr formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If metallizing is performed by causing metal fine particles to adhere through sputtering, then the conductor film is provided on the outer surface, but excess conductor film adheres on the adhesive layer and forms burrs that can cause short circuits
Solution Approach 1:
The adhesive layer is divided into multiple regions: a first adhesive region that contacts the base and a second adhesive region that does not contact the base. The conductor film is formed only on the first adhesive region, preventing excess conductor film from adhering to the second adhesive region and forming burrs that could cause short circuits.
Solution Approach 2:
Different regions of the adhesive layer are treated differently: the first adhesive region receives the conductor film through sputtering while the second adhesive region is protected or excluded from the metallizing process. This local differentiation ensures conductor film formation where needed while preventing burr formation in critical areas.
2Productivity
If the circuit module is peeled off from the base, then the circuit module is separated from the manufacturing support, but excess conductor film remains on the adhesive layer and may form burrs
Solution Approach 1:
The adhesive layer is pre-configured with distinct first and second adhesive regions before the metallizing process. The first adhesive region is designated to receive the conductor film while the second adhesive region is prepared to remain free of conductor film, ensuring that when the module is peeled off, no burrs form from excess conductor film on the second region.
3Reliability
If the conductor film is applied broadly on the outer surface, then complete coverage is achieved, but burr formation risk increases at the edges and adhesive interfaces
Solution Approach 1:
The adhesive layer is segmented into a first adhesive region for conductor film application and a second adhesive region excluded from conductor film formation. This segmentation ensures complete coverage where needed while eliminating burr formation risks at edges and interfaces by preventing conductor film deposition on the second region.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses the adhesion of burrs, enhancing the reliability of the circuit module by preventing short circuits and ensuring the integrity of the electronic apparatus.
Implementation Method 1
metallizing is performed by causing metal fine particles to adhere, for example, through sputtering
Data Source
AI summary
A circuit module (100) includes: a substrate (10) including a plurality of inner conductors (2); a first electronic component arranged on one main surface (S1) of the substrate (10); a first resin layer (40) provided on the one main surface (S1) and configured to seal the first electronic component; a plurality of outer electrodes (B1) provided on another main surface (S2) of the substrate (10) and including a ground electrode; a conductor film (50) provided at least on an outer surface of the first resin layer (40) and a side surface (S3) of the substrate (10) and connected to the ground electrode with at least one of the plurality of inner conductors (2) interposed therebetween; and a resin film (60).