Circuit Module Segmented Photonic Conversion Units
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Solution Overview
Problem
The integration of electronic and photonic functions in multi-chip modules is challenging due to differing attachment materials, where soldering processes for electronic connections can damage photonic attachments, and replacing faulty photonic channels often requires replacing the entire module.
Innovation Solution
A circuit module design that co-packages electronic and photonic domains with separable photonic conversion units, allowing for direct contact without bonding materials, and a shared thermal solution using a heat sink integrated into the retention assembly, enabling easy replacement and improved signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering processes are used for electronic connections, then electrical functionality is achieved, but photonic attachments are damaged
Solution Approach 1:
The patent divides the module into separable photonic conversion units and electronic components. The photonic conversion units can be independently replaced without affecting the electronic components, allowing soldering of electronics while protecting photonic attachments from damage during reflow processes.
Solution Approach 2:
The patent introduces a substrate as an intermediary between electronic components and photonic conversion units. This substrate provides separate attachment mechanisms: solder balls for electronic components and epoxy compounds for photonic conversion units, allowing each to be attached with appropriate materials without interfering with the other.
2Stability of the object's composition
If photonic conversion units are permanently attached, then module stability is improved, but replacement of faulty channels requires entire module replacement
Solution Approach 1:
The patent segments the module into permanently attached electronic components on the substrate and separately attachable photonic conversion units. This segmentation allows photonic conversion units to be permanently secured during manufacturing while maintaining the capability for independent replacement later, resolving the contradiction between stability and repairability.
Solution Approach 2:
The patent creates a dynamic attachment system where photonic conversion units can transition from a permanently secured state during manufacturing to a replaceable state during maintenance. The retention assembly allows these units to be firmly held during operation but can be released for replacement of faulty channels without replacing the entire module.
3Strength
If bonding materials are used for photonic attachments, then attachment strength is improved, but solder reflow temperatures damage the bonding materials
Solution Approach 1:
The patent changes the temperature parameter profile during manufacturing processes. Electronic components undergo soldering at high temperatures while photonic conversion units are attached separately at lower temperatures using epoxy compounds. This parameter separation allows bonding materials to achieve sufficient strength without exposure to damaging reflow temperatures.
Solution Approach 2:
The patent uses different bonding materials as intermediaries for different component types: solder balls for electronic components that require high-temperature attachment, and epoxy compounds for photonic conversion units that require lower-temperature attachment. This intermediary approach allows each material to operate within its optimal temperature range without degradation.
4Reliability
If separate attachment processes are used for electronic and photonic components, then component integrity is maintained, but manufacturing complexity increases
Solution Approach 1:
The patent merges the attachment processes by using a common substrate that provides attachment structures for both electronic components and photonic conversion units. The substrate with its pattern of solder balls and epoxy regions serves as a unified platform, allowing separate attachment processes to be coordinated within a single manufacturing framework, reducing overall complexity.
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support for both electronic and photonic components, provides electrical connections through solder balls, and provides optical connections through epoxy-attached photonic conversion units. This multi-functionality reduces the need for separate structures and simplifies the overall manufacturing process despite the different attachment requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for reliable and efficient co-packaging of electronic and photonic functions, improving signal integrity, reducing power requirements, and simplifying module replacement and thermal management, while avoiding the risks associated with solder reflow temperatures.
Implementation Method 1
a heat sink in thermal contact with the plurality of photonic conversion units
Data Source
AI summary
A circuit module can include a substrate, a photonic conversion unit placed on the substrate; and a retention assembly. The retention assembly can include a heat sink in thermal contact with the photonic conversion unit and a fastener. The fastener can be mechanically coupled to both the substrate and the heat sink, and configured to press the heat sink against the photonic conversion unit. The photonic conversion unit is removably secured to the substrate by the retention assembly without the use of a bonding material.