Circuit Module With Segmented Sealing Resin For Volumetric Efficiency
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Solution Overview
Problem
Circuit modules with mixed-height electronic components suffer from inefficient use of resin, resulting in unused space due to excessive resin thickness over shorter components, which affects volumetric efficiency.
Innovation Solution
The circuit module design includes a substrate with a wiring pattern, where shorter electronic components are mounted with conductive posts that are exposed after resin sealing, allowing for reduced resin height over these components, enabling additional wiring and mounting of third components in previously unused space, thereby improving volumetric efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the sealing resin height is adjusted to the height of taller electronic components, then all components are adequately sealed, but excessive resin thickness is formed over shorter components, reducing volumetric efficiency
Solution Approach 1:
The sealing resin is divided into multiple regions with different heights: a first region with height equal to the shorter electronic components and a second region with height equal to the taller electronic components. This segmentation allows each region to be optimized for its specific components, avoiding excessive resin thickness while ensuring adequate sealing for all components.
Solution Approach 2:
Different regions of the sealing resin are given different local qualities (heights) according to the specific needs of the electronic components in each region. The first region has a lower height suitable for shorter components, while the second region has a higher height for taller components, optimizing both sealing effectiveness and volumetric efficiency.
2Volume of stationary object
If the sealing resin height is reduced to match shorter electronic components, then volumetric efficiency improves, but taller electronic components are not adequately sealed
Solution Approach 1:
The sealing resin structure is segmented into a first region with lower height for shorter components and a second region with higher height for taller components. This ensures that each component type receives appropriate sealing height, maintaining reliability while improving overall volumetric efficiency.
Solution Approach 2:
The sealing resin is designed with different local heights in different regions, providing exactly the right amount of sealing for each component type without over-sealing, thus optimizing volumetric efficiency while maintaining adequate sealing for all components.
3Reliability
If the sealing resin height is uniformly increased, then sealing reliability is ensured for all components, but additional wiring and components cannot be mounted in the unused space
Solution Approach 1:
The sealing resin is segmented into regions of different heights, creating a first region with lower height that exposes conductive posts for additional wiring and component mounting, while the second region provides adequate sealing for taller components. This segmentation simultaneously achieves sealing reliability and enhanced adaptability.
Solution Approach 2:
By creating height differentiation in the sealing resin structure, the patent utilizes the vertical dimension to create functional zones: a lower first region for wiring and additional components, and a higher second region for sealing. This dimensional variation enables both sealing reliability and mounting flexibility.
4Volume of stationary object
If the sealing resin height is uniformly reduced, then volumetric efficiency improves, but wiring density and flexibility are limited
Solution Approach 1:
The sealing resin is divided into a first region with lower height that provides space for high-density wiring and additional components, and a second region with higher height for sealing. This segmentation improves volumetric efficiency while enhancing wiring density and flexibility in the first region.
Solution Approach 2:
Different regions of the sealing resin are assigned different local heights to optimize specific functions: the first region has lower height to accommodate dense wiring and additional components, while the second region has higher height for adequate sealing, achieving both volumetric efficiency and wiring flexibility.
Data Source
AI summary
A circuit module includes: a substrate including a wiring pattern; a first region in which a first electronic component is mounted on one major surface of the substrate; a second region in which a second electronic component, which is taller than the first electronic component, is mainly mounted on the one major surface of the substrate; a first conductor provided in the first region and electrically connected with the wiring pattern; and sealing resin that seals the first electronic component, the second electronic component, and the first conductor. Sealing resin sealing the first region is formed to be shorter than sealing resin sealing the second region, part of the first conductor is exposed on a surface of the sealing resin, wiring is formed on the surface of the sealing resin, and the first conductor the part of which is exposed is electrically connected with the wiring.