Electronic Circuit Module Shielding via 3D Via Contact
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Solution Overview
Problem
Existing electronic circuit modules face challenges in ensuring a stable connection between the conductive film serving as a shield layer and the ground electrode, leading to potential instability in the connection area and inadequate shield effects.
Innovation Solution
The electronic circuit module design includes a circuit board with a conduction path featuring via conductors that extend to the ground electrode, where the conductive film is connected to exposed portions of the via conductors, forming a three-dimensional contact area, thereby enhancing the connection and shield effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a flat cutting surface is used to connect the conductive film to the via conductor, then the manufacturing process is simple, but the connection area becomes small and connection reliability is insufficient
Solution Approach 1:
The patent transitions from a two-dimensional flat cutting surface to a three-dimensional inverted cone-shaped connection surface. This dimensional change allows the conductive film to contact the via conductor over a larger area, improving connection reliability while maintaining manufacturing feasibility through standardized molding processes.
Solution Approach 2:
The connection surface is designed with a curved inverted cone shape rather than a flat plane. This curvature increases the contact area between the conductive film and via conductor, enhancing connection stability without significantly complicating the manufacturing process.
2Reliability
If the connection surface area is increased to improve shield effect, then electrical characteristics improve, but the manufacturing complexity increases
Solution Approach 1:
By forming the connection surface as an inverted cone extending in the thickness direction of the circuit board, the patent achieves a larger effective connection area without increasing the planar footprint. This three-dimensional approach improves shield effect while maintaining compact device dimensions and reasonable manufacturing complexity.
3Reliability
If a simple flat connection surface is used, then manufacturing is easier, but electric resistance increases and electrical characteristics deteriorate
Solution Approach 1:
The inverted cone-shaped connection surface provides increased contact area between the conductive film and via conductor, reducing contact resistance and improving electrical characteristics. The curved geometry can be achieved through standard molding techniques, maintaining ease of manufacture.
Data Source
AI summary
An electronic circuit module includes a circuit board, electronic components, an embedding layer, and a conductive film. The circuit board has a first principal surface, a second principal surface and a side surface, and includes a pattern conductor and a via conductor. The conductive film is connected to a conduction path to a ground electrode. The side surface includes a first region, a second region having a longer circumferential length than the first region, and a connection region connecting the first region and the second regions. The conductive film is formed on a region including at least part of each of an outer surface of the embedding layer, the first region, and the connection region. The conductive film formed on at least part of the connection region is connected to an exposed portion in the connection region of the via conductor included in the conduction path to the ground electrode.