Circuit Module Shielding Grooves Laser Processing
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Solution Overview
Problem
Existing circuit modules face limitations in design freedom for electromagnetic shielding, struggle to precisely control slit depth, and incur increased production costs due to complex component mounting and laser processing challenges, while also risking damage to wiring and inefficient shielding against electromagnetic waves.
Innovation Solution
A circuit module design featuring a conductive shield with a first, second, and third shielding section, where the third section is formed along a conductive pattern with grooves shaped to connect to the second section and have a wider end, using a laser to form grooves in a sealing layer that reaches the conductive pattern, ensuring electrical connection and enhanced shielding capabilities while protecting the wiring from laser damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If dicing is used to form slits that penetrate the mold resin layer, then the slits can be formed, but the shape of the slits is limited to a straight line only and cannot be curved or branched
Solution Approach 1:
The patent replaces the mechanical dicing method with laser processing to form grooves in the sealing layer. This substitution allows the grooves to be formed in curved or branched patterns that follow the conductive pattern, providing design freedom for the shield shape while maintaining ease of manufacture through laser processing.
2Ease of manufacture
If dicing is used to form slits, then the slits can be formed, but the depth of the slits cannot be precisely controlled and it is difficult to have the bottom of the slit electrically contact the wiring directly below the slit
Solution Approach 1:
The patent replaces mechanical dicing with laser processing, which allows precise control of groove depth. The laser can be controlled to etch the sealing layer to a specific depth that reaches the conductive pattern, ensuring electrical contact between the conductive resin filled in the groove and the underlying wiring.
3Reliability
If a conductive shielding wall is formed via a plurality of conductive components mounted on the circuit board, then electromagnetic shielding can be achieved, but production costs will increase as the number of components and the number of mounting steps increase
Solution Approach 1:
The patent merges the sealing layer structure with the electromagnetic shielding function by forming grooves in the sealing layer and filling them with conductive resin. This integration eliminates the need for separate conductive components and mounting steps, reducing device complexity while maintaining reliable electromagnetic shielding through the continuous conductive path provided by the resin-filled grooves.
4Ease of manufacture
If laser beam is used to form a groove by adjusting the strength of the laser beam, then the groove can be formed, but if the laser beam is too strong it is impossible to avoid damaging the wiring on the circuit board, and if the laser beam is too weak efficiency decreases and productivity cannot be maintained
Solution Approach 1:
The patent applies local quality by concentrating the laser beam energy precisely on the sealing layer material while avoiding the underlying conductive pattern and wiring. The laser processing parameters are optimized to etch only the sealing layer to the required depth, maintaining wiring integrity while achieving efficient groove formation through localized energy application.
5Stability of the object's composition
If a trench is formed with shallow portions at both edges, then warping and deformation can be prevented, but the shallow portions of the trench have a lower ability to block electromagnetic waves than the portion of the trench that is not shallow
Solution Approach 1:
The patent resolves this contradiction by extending the groove in the sealing layer to reach the conductive pattern at the bottom, adding a vertical dimension to the shielding structure. This creates a continuous conductive path from the groove through the sealing layer to the conductive pattern, ensuring effective electromagnetic wave blocking while maintaining structural stability without requiring shallow portions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design provides high design freedom for the shield shape, ensures electrical connection between the wiring and shield, enhances electromagnetic shielding, and suppresses warping and deformation, while maintaining low production costs and efficient productivity.
Implementation Method 1
forming, along the conductive pattern, grooves in the sealing layer having a depth that reaches the conductive pattern by irradiating a surface of the sealing layer with a laser beam
Data Source
AI summary
A circuit module, including: a substrate having electronic components mounted thereon and further having a conductive pattern that defines respective shielded areas where the electronic components are mounted; a sealing layer covering the substrate and the electronic components, the sealing layer having grooves formed therein along the conductive pattern; and a conductive shield, including: a first shielding section covering a top surface of the sealing layer; a second shielding section covering side faces of the sealing layer; and a third shielding section filling the grooves in the sealing layer, wherein the grooves are shaped such that the third shielding section has at least one end thereof connected to the second shielding section, the third shielding section thereby acting as shielding walls partitioning the respective shielded areas, and that said at least one end of the third shielding section has a width wider than other portions of the third shielding section.