Circuit Module Shielding Layer Grounding
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Solution Overview
Problem
Existing circuit modules with shielding layers on insulating layers over electronic components on substrates face high combined resistance issues, leading to insufficient grounding of electrostatic noise, affecting internal circuits and allowing external noise transmission.
Innovation Solution
The solution involves a substrate with multiple inner conductive layers directly connected to a shielding layer, which reduces combined resistance by ensuring uniform potential and exposing these layers on end surfaces for direct connection, thereby effectively grounding electrostatic noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shielding layer is formed on the surface of the insulating layer, then electrostatic noise shielding is provided, but the combined resistance becomes large and grounding becomes insufficient
Solution Approach 1:
The invention divides the grounding path into multiple segments by introducing multiple inner conductive layers (first, second, and third inner conductive layers) that are sequentially connected to the shielding layer. This segmentation creates multiple parallel grounding paths, reducing the overall combined resistance while maintaining effective electrostatic noise shielding.
Solution Approach 2:
The invention transitions from a single-layer grounding structure to a multi-layer three-dimensional structure. The first, second, and third inner conductive layers are disposed at different positions and connected to the shielding layer from different dimensions, creating a spatial network that reduces resistance while maintaining shielding effectiveness.
2Strength
If the insulating layer covers the electronic component, then the electronic component is protected, but the inner conductive layers cannot be directly connected to the shielding layer
Solution Approach 1:
The invention implements a nested structure where the first, second, and third inner conductive layers are embedded within the insulating layer, which in turn is covered by the shielding layer. This nested arrangement allows direct connection between the inner conductive layers and the shielding layer while maintaining the protective coverage of the insulating layer over the electronic component.
Solution Approach 2:
The insulating layer serves as an intermediary that simultaneously provides protection to the electronic component and allows the inner conductive layers to be positioned and connected to the shielding layer. The structure mediates between the need for component protection and the need for direct electrical connection for grounding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces the combined resistance, ensuring that electrostatic noise is adequately grounded and not transmitted externally, protecting internal circuits from noise interference.
Implementation Method 1
a combined resistance generated by the shielding layer and the inner conductive layers is small. Accordingly, electrostatic noise externally received by the shielding layer can be sufficiently grounded
Data Source
AI summary
A circuit module includes a substrate that has a substantially rectangular parallelepiped shape and includes a plurality of inner conductive layers, an electronic component disposed on a first main surface of the substrate, an insulating layer disposed on the first main surface of the substrate so as to cover the electronic component, a shielding layer disposed on a surface of the insulating layer, and a ground electrode connected to the plurality of inner conductive layers. At least two of the inner conductive layers are directly connected to the shielding layer.